Substrate Panel Bus Line Spacing for Uniform Plating
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Solution Overview
Problem
In the manufacturing process of printed circuit boards, the uneven distribution of electric current due to constant interval bus lines leads to deviations in plating, particularly affecting substrate units farther from clamp contacts, resulting in inadequate current supply and uneven plating.
Innovation Solution
The substrate panel design includes a pair of clamp contacts with bus lines arranged in increasing intervals closer to the proximal clamp contact, and insulation parts between clamp contacts and bus lines to ensure uniform current distribution, facilitating even plating across all substrate units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bus lines are arranged in constant intervals between clamp contacts, then the manufacturing process is simple, but the electric current distribution becomes uneven
Solution Approach 1:
The patent applies local quality by varying the interval between bus lines based on their position relative to clamp contacts. Specifically, the interval is set to be smaller near clamp contacts where current density is higher, and larger farther away where current density is lower. This non-uniform spacing compensates for the exponential decay of current with distance, ensuring substantially uniform current distribution across all substrate units and consequently uniform plating thickness.
2Manufacturing precision
If bus lines are arranged closer together near clamp contacts, then current distribution improves, but device complexity increases
Solution Approach 1:
The patent applies parameter changes by systematically varying the spacing parameter of bus lines based on their position. The interval between adjacent bus lines is defined as a function of their distance from clamp contacts, specifically making it smaller near clamp contacts and larger farther away. This parameter variation compensates for the exponential current decay, achieving uniform current distribution while maintaining a manageable and systematic arrangement pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement ensures a uniform distribution of electric current over the substrate panel, allowing for consistent plating thickness across all substrate units, thereby improving the plating process efficiency.
Implementation Method 1
bus lines located between the pair of clamp contacts... serve as paths by which an electric current supplied at the clamp contacts may be supplied to the substrate units
Implementation Method 2
In the manufacturing process for a printed circuit board, plating processes are of utmost importance... supply an electric current to the substrate units
Data Source
AI summary
A substrate panel is disclosed. The substrate panel may include a pair of clamp contacts, a plurality of bus lines located between the pair of clamp contacts, and a plurality of substrate units supplied with an electric current by way of the plurality of bus lines, where the bus lines closer to the proximal clamp contact are arranged with larger intervals.