Substrate Structure With Parallel Build-Up Layers for Higher Yield

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Solution Overview

Problem

The increase in the number of circuit sub-layers in substrate structures lengthens manufacturing processes, increases delivery time, reduces board utilization rate, and raises the risk of low yield and cumulative offset of circuit sub-layers.

Innovation Solution

The substrate structure is divided into a core layer and two circuit build-up layers for concurrent production, with each layer having multiple circuit sub-layers, reducing the number of build-up processes and cumulative offset.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the number of circuit sub-layers is increased to provide sufficient layout space, then the unit size increases, but the board utilization rate decreases

Engineering Contradiction:

Improveunit sizeVSAvoidboard utilization rate

Core Design Contradiction:

Area of stationary objectVSProductivity

Solution Approach 1:

The substrate structure is divided into a core layer and two separate circuit build-up layers (first and second), each built up independently on opposite sides. This segmentation allows parallel processing of multiple circuit layers without requiring sequential layer-by-layer construction, thereby improving board utilization rate while maintaining sufficient unit size for layout requirements

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If the number of circuit sub-layers is increased, then layout space is provided, but the manufacturing process lengthens and delivery time increases

Engineering Contradiction:

Improvelayout spaceVSAvoidmanufacturing process time

Core Design Contradiction:

Area of stationary objectVSLoss of time

Solution Approach 1:

The first and second circuit build-up layers are prepared in advance as separate entities before being bonded to the core layer. This preliminary preparation allows concurrent manufacturing of multiple circuit layers, significantly reducing the overall manufacturing process time and delivery time while providing sufficient layout space through the combined structure

Inventive Principle:

Principle #10Preliminary action

3Area of stationary object

If the number of circuit sub-layers is increased, then layout capacity improves, but the risk of low yield increases due to accumulated defects

Engineering Contradiction:

Improvelayout capacityVSAvoidmanufacturing yield

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

By segmenting the circuit build-up process into separate first and second build-up layers manufactured independently, defects are isolated to individual layers rather than accumulating across a single sequential process. This segmentation improves manufacturing yield while maintaining high layout capacity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first and second circuit build-up layers are manufactured in advance as separate completed units with their own quality control, then bonded to the core layer. This preliminary completion and independent quality verification of each layer reduces the risk of cumulative defects and improves overall manufacturing yield

Inventive Principle:

Principle #10Preliminary action

4Area of stationary object

If the number of circuit sub-layers is increased, then layout space is provided, but the cumulative offset of circuit sub-layer alignment increases

Engineering Contradiction:

Improvelayout spaceVSAvoidalignment offset

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The circuit build-up process is segmented into two independent build-up layers manufactured separately, reducing the number of sequential alignment steps. This segmentation minimizes cumulative alignment offset while providing sufficient layout space through the distributed multi-layer structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first and second circuit build-up layers are manufactured in advance with their alignment features pre-established, then bonded to the core layer in a single alignment operation. This preliminary preparation of alignment references reduces cumulative alignment errors and improves manufacturing precision

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20260005172A1Substrate structure and manufacturing method thereof

Publication Date: 2026.01.01 SILICONWARE PRECISION IND CO LTD

AI summary

A substrate structure and a manufacturing method thereof are provided, in which a core layer having first and second connection pads is formed, and first bonding pads of a first circuit build-up layer and second bonding pads of a second circuit build-up layer are respectively bonded to the first connection pads and the second connection pads, so that the first circuit build-up layer and the second circuit build-up layer are respectively located on a first side and a second side of the core layer, and a first gap is formed between the first side and the first circuit build-up layer, and a second gap is formed between the second side and the second circuit build-up layer. Thereby, the core layer and the first and second circuit build-up layers can be manufactured separately and concurrently, thereby shortening the manufacturing process of the substrate structure and improving the yield of the substrate structure.