Substrate Parallel Current Path for Noise Absorption
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Solution Overview
Problem
Existing electronic devices with feedthrough capacitors face challenges in efficiently removing high-frequency noise while minimizing heat generation and size, as the current paths formed by wiring conductors either have insufficient impedance or require additional space for noise removal.
Innovation Solution
A substrate design with a feedthrough capacitor and a parallel current path formed by a wiring conductor and via-hole conductors, which divides the DC current and increases impedance for effective noise absorption, allowing for compact size and reduced heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a feedthrough capacitor is used to remove high-frequency noise, then noise absorption performance is improved, but heat generation increases due to current concentration
Solution Approach 1:
The patent divides the current path into multiple segments by introducing a parallel wiring conductor alongside the feedthrough electrode. This segmentation distributes the DC current across multiple paths, reducing current concentration in the feedthrough electrode and thereby decreasing heat generation while maintaining noise absorption capability.
Solution Approach 2:
The patent introduces a wiring conductor as an intermediary element that works in parallel with the feedthrough electrode. This intermediary provides an alternative current path that mediates the current flow, reducing the burden on the feedthrough electrode and minimizing heat generation while the feedthrough capacitor continues to absorb high-frequency noise.
2Temperature
If wiring conductors are added to create parallel current paths, then heat generation is reduced, but device complexity increases
Solution Approach 1:
The patent merges the wiring conductor with the existing substrate structure, integrating it into the substrate body rather than adding it as a separate external component. This merging approach creates the parallel current path needed to reduce heat generation while minimizing the increase in device complexity by utilizing the substrate's existing structural framework.
Solution Approach 2:
The wiring conductor serves multiple functions: it provides a parallel current path to reduce heat generation, maintains electrical connectivity, and integrates with the substrate structure. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity while achieving heat reduction.
3Area of stationary object
If the wiring conductor is placed on the same surface as the capacitor, then device size is reduced, but noise absorption effectiveness decreases
Solution Approach 1:
The patent transitions the wiring conductor from a two-dimensional surface placement to a three-dimensional configuration by extending it underneath the capacitor through via-hole conductors. This dimensional change allows the wiring conductor to occupy vertical space rather than horizontal space, maintaining compact device footprint while ensuring sufficient separation between the wiring conductor and capacitor to preserve noise absorption effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses heat generation and enhances noise absorption performance by distributing the current through parallel paths with higher impedance, efficiently removing high-frequency noise without increasing the device's size.
Implementation Method 1
the wiring conductor and the via-hole conductor form a second current path which is electrically connected in parallel to a first current path formed by the feedthrough electrode... increases impedance for effective noise absorption
Implementation Method 2
a capacitor electrode which forms capacity in cooperation with the feedthrough electrode... effectively suppresses heat generation and enhances noise absorption performance
Data Source
AI summary
An electronic device which includes a feedthrough capacitor mounted on a front surface of a substrate. A feedthrough electrode penetrates a laminate (body of the capacitor). External electrodes are electrically connected to opposite ends of the feedthrough electrode. A capacitor electrode is disposed to form capacity in cooperation with the feedthrough electrode. A wiring conductor is formed on a rear surface of the substrate or inside the substrate, and via-hole conductors are connected to the wiring conductor. The feedthrough electrode and the external electrodes constitute a first current path. The wiring conductor and the via-hole conductors constitute a second current path electrically connected in parallel to the first current path.