Substrate Processing Parameter Correction Across Multiple Levels
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Solution Overview
Problem
Existing substrate processing methods struggle to accurately correct processing parameters across multiple levels of processing units, leading to variations in substrate characteristics such as film thickness.
Innovation Solution
A substrate processing control method that acquires data sets from substrates processed at multiple levels, calculates expected values and level deviations of substrate characteristics, and corrects processing parameters based on these calculations to minimize norm deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate processing is performed across multiple levels using multiple processing units, then productivity is improved, but manufacturing precision deteriorates due to variations in substrate characteristics
Solution Approach 1:
The patent segments the processing system into multiple levels (first level processing units and second level processing units) with distinct functions. The first level performs initial processing while the second level performs subsequent processing, allowing each segment to be optimized independently while maintaining overall system productivity and precision through hierarchical organization.
Solution Approach 2:
The patent implements parameter changes by dynamically adjusting processing parameters based on measured substrate characteristics. The system measures actual substrate parameters and modifies processing conditions accordingly, enabling consistent manufacturing precision across multiple processing units and levels while maintaining high productivity through automated parameter optimization.
2Manufacturing precision
If processing parameters are corrected based on single-level measurements, then manufacturing precision is improved, but device complexity increases due to multi-level coordination requirements
Solution Approach 1:
The patent implements feedback mechanisms where substrate characteristics are measured after processing and the results are used to correct processing parameters for subsequent substrates. This closed-loop feedback system enables accurate parameter correction across multiple levels while managing complexity through automated feedback control algorithms that coordinate between different processing units.
Solution Approach 2:
The patent applies preliminary action by performing measurements and parameter corrections in advance before actual processing. The system measures substrate characteristics and calculates corrected parameters beforehand, then applies these corrections to subsequent processing operations, enabling high precision without real-time complex coordination during the actual processing phase.
Data Source
AI summary
A substrate processing control method in a substrate processing apparatus, includes: acquiring a data set for each substrate sequentially subjected to first and second processes at first and second levels, the data set including information specifying the first level at which the first process has been performed, information specifying the second level at which the second process has been performed and information about a characteristic amount relating to characteristics of the substrate; calculating information including an expected value of the characteristic amount, and level deviations of the first and second levels to the expected value based on the data set, and correcting the first parameter at the first level or the second parameter at the second level based on the calculated information.