Substrate Processing Parameter Correction Across Multiple Levels
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Solution Overview
Problem
Existing substrate processing methods face challenges in accurately correcting parameters across multiple processing units, leading to variations in film thickness and characteristics, especially when data sets are insufficient for conventional methods like the least square method.
Innovation Solution
A substrate processing control method that acquires data sets from multiple substrates processed across different levels, calculates expected values and level deviations, and corrects parameters based on these calculations to minimize norm deviations, prioritizing correction values according to predetermined norms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional correction methods (e.g., least square method) are used with insufficient data sets, then parameter correction cannot be accurately performed, but increasing data collection time reduces productivity
Solution Approach 1:
The patent transforms the correction problem from a data-intensive approach to a model-based approach by changing the parameters from raw measurement data to pre-calculated correction values stored in lookup tables. This allows accurate parameter correction without requiring large data sets, resolving the contradiction between measurement precision and productivity
Solution Approach 2:
The patent performs preliminary calculations to generate correction value tables before actual substrate processing. By pre-calculating correction values for various condition combinations, the system avoids the need to collect and process large amounts of data during production, thus maintaining high accuracy while preserving productivity
2Productivity
If multiple processing units are used to increase productivity, then variations in film thickness and characteristics increase, but reducing the number of processing units decreases productivity
Solution Approach 1:
The patent applies local quality by creating unit-specific correction tables for each processing unit based on their individual characteristics. Each processing unit receives customized correction values tailored to its specific performance characteristics, allowing multiple units to operate simultaneously while maintaining consistent output quality across all units
Solution Approach 2:
The system changes parameters by adjusting processing conditions based on pre-calculated correction values specific to each processing unit. This allows the system to accommodate variations between multiple processing units while maintaining consistent film thickness and characteristics, enabling high productivity without sacrificing manufacturing precision
3Manufacturing precision
If correction values are calculated for all processing units to improve consistency, then the complexity of the correction system increases, but simplifying the correction system reduces processing consistency
Solution Approach 1:
The patent segments the correction system into independent unit-specific correction tables, where each processing unit has its own correction values. This segmentation allows the system to maintain high processing consistency through unit-specific corrections while keeping the overall system manageable by dividing it into independent, easily configured components
Solution Approach 2:
The patent uses copying by creating correction value tables that can be replicated and applied across multiple processing units. Once correction values are calculated for one unit, similar patterns can be copied to other units, reducing the overall complexity while maintaining consistency across the system
Data Source
AI summary
A substrate processing control method in a substrate processing apparatus, includes: acquiring a data set for each substrate sequentially subjected to first and second processes at first and second levels, the data set including information specifying the first level at which the first process has been performed, information specifying the second level at which the second process has been performed and information about a characteristic amount relating to characteristics of the substrate; calculating information including an expected value of the characteristic amount, and level deviations of the first and second levels to the expected value based on the data set; and correcting the first parameter at the first level or the second parameter at the second level based on the calculated information.