Multi-Layer Interconnection Substrate Partial Adhesion Separation
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Solution Overview
Problem
Current methods for manufacturing multi-layer interconnection substrates face challenges in achieving high size precision and easy, low-cost separation of the IC board from the substrate, which complicates the manufacturing process and increases costs.
Innovation Solution
A substrate with a multi-layer interconnection structure is adhered to the substrate in partial areas, allowing for easy separation by cutting and using a selective-area adhering method, which includes applying a silane promoter and using a mixed solution of sulfuric acid and hydrogen peroxide for recycling, thereby simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a multi-layer interconnection structure is fully adhered to a substrate for manufacturing support, then manufacturing precision is improved, but separation becomes difficult and complex
Solution Approach 1:
The adhesion between the multi-layer interconnection structure and substrate is segmented into two distinct zones: a first adhesion zone with strong bonding for manufacturing support, and a second adhesion zone with weak bonding for easy separation. This segmentation allows the structure to benefit from both strong adhesion during manufacturing and easy separation afterward, resolving the contradiction between manufacturing precision and separation ease.
Solution Approach 2:
Different adhesion properties are applied to different regions of the multi-layer interconnection structure. The first adhesion zone (peripheral region) has strong adhesion to provide manufacturing support, while the second adhesion zone (central region) has weak adhesion to enable easy separation. This local differentiation of adhesion quality allows simultaneous achievement of manufacturing precision and ease of separation.
2Ease of manufacture
If conventional separation methods like laser ablation are used, then separation can be achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The adhesion structure is designed in advance with a first adhesion zone and a second adhesion zone having different bonding strengths before the separation process begins. This preliminary design of differential adhesion zones eliminates the need for complex separation processes like laser ablation, as separation can be simply achieved by peeling from the weak adhesion zone, thereby reducing manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the manufacturing of multi-layer interconnection devices with improved size precision and flexibility, facilitating easier and more cost-effective production compared to conventional methods like laser ablation.
Implementation Method 1
applying a silane promoter
Implementation Method 2
using a mixed solution of sulfuric acid and hydrogen peroxide for recycling
Data Source
AI summary
The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The invention also provides a method of manufacturing and recycling such substrate and a method of packaging electronic devices by using such substrate. The invention also provides a method of manufacturing multi-layer interconnection devices.