Metal-Ceramic Substrate Bonding for Extended Lateral Terminals
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Solution Overview
Problem
Existing methods for producing metal-ceramic substrates with laterally protruding metal sections are inefficient and result in low yield, as they require mechanical stripping or complex strip technology, limiting the size and effectiveness of the terminals.
Innovation Solution
A method involving a ceramic and metal layer arrangement where the metal layer is partially separated from the ceramic layer without a material bond in specific areas, allowing for the formation of lateral terminals by bending, and using etching or soldering processes to create a second area that serves as a terminal, reducing structural complexity and increasing terminal length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If mechanical stripping is used to form lateral terminals, then terminals can be created, but only small terminals can be produced and considerable effort is required with low yield
Solution Approach 1:
The metal layer is provided with a lateral extension beyond the ceramic layer before bonding occurs. This preliminary configuration allows the terminal to already exist in its final extended position, eliminating the need for post-bonding mechanical stripping operations and enabling direct formation of larger terminals with higher yield
Solution Approach 2:
Instead of forming terminals by removing material after bonding (stripping), the invention inverts the approach by providing the metal layer extension before bonding. The terminal is formed by what remains after selective removal of the ceramic layer, rather than by removing metal after bonding
2Ease of operation
If strip technology is used to implement terminals, then terminals can be created, but production is difficult to automate and is not efficient
Solution Approach 1:
The metal layer is configured with lateral extension and bonding areas defined before the bonding process. This preliminary structuring allows automated bonding equipment to simply place and bond the metal layer in predetermined positions, making the process highly automatable without requiring complex strip technology
Solution Approach 2:
The metal layer is segmented into bonding areas (where it contacts the ceramic) and terminal areas (the lateral extension). This segmentation allows different regions to serve different functions and enables automated processes to treat each region appropriately during bonding and subsequent processing
3Strength
If the metal layer is bonded to the ceramic layer in all areas, then strong connection is achieved, but lateral terminals cannot protrude beyond the ceramic layer
Solution Approach 1:
The bonding interface is segmented into bonding areas where the metal layer contacts and bonds to the ceramic layer, and non-bonding areas where the metal layer extends laterally without ceramic contact. This segmentation allows the metal layer to provide both strong bonded connection and protruding terminal functionality
Solution Approach 2:
The metal layer has different functional qualities in different regions: in bonding areas it provides strong mechanical and electrical connection to the ceramic, while in lateral extension areas it provides protruding terminal access. The ceramic layer similarly has bonding regions and removed regions to enable this local differentiation
Data Source
Figure 1a~1e
Figure 1f~1g
Figure 2a~2e
AI summary
The invention relates to a method for producing a metal-ceramic substrate (1) which, when complete, comprises a ceramic layer (11) and a metal layer (12), which extend along a main extension plane (HSE) and are arranged one on top of the other in a stacking direction (S) that extends perpendicularly to the main extension plane (HSE), the method comprising the steps: -- providing the metal layer (12) and the ceramic layer (11), and -- connecting the metal layer (12) in some regions to the ceramic layer (11) to form a first region (B1), which has an integral bond between the metal layer (12) and the ceramic layer (11), and a second region (B2) in which, when viewed in the stacking direction (S), the metal layer (12) and the ceramic layer (11) are arranged one on top of the other without integral bond. A predetermined breaking line is preferably provided.