Substrate Loading Particle Removal Using Nozzle-Surround Intake
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Solution Overview
Problem
Contaminant particles on substrate surfaces significantly affect the operation of semiconductor devices as they become smaller, leading to potential failures and reduced productivity.
Innovation Solution
A substrate loading apparatus with a particle removal device that includes a nozzle for injecting gas and an intake hole surrounding the nozzle, which removes contaminant particles by changing the internal pressure and using a transfer track to move the device over the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a particle removal device is introduced to remove contaminant particles from substrate surfaces, then substrate cleanliness and device reliability are improved, but device complexity and processing time are increased
Solution Approach 1:
The patent employs a pneumatic particle removal device that uses gas flow through a nozzle to remove contaminant particles from substrate surfaces. The device includes a housing with a nozzle positioned to direct gas flow onto the substrate, and an intake hole surrounded by a shield structure. This pneumatic approach eliminates the need for complex mechanical contact systems while effectively removing particles, thus improving device reliability without proportionally increasing device complexity.
Solution Approach 2:
The patent introduces a gas flow as an intermediary medium to remove contaminant particles. Instead of direct mechanical contact between the substrate and cleaning components, gas acts as a mediator that carries particles away from the substrate surface. The shield structure around the intake hole serves as another intermediary element that directs gas flow and prevents scattered particles from contaminating other areas, resolving the contradiction between effective particle removal and system complexity.
2Manufacturing precision
If a particle removal device with shield structure is used to prevent particle scattering, then substrate cleanliness is improved, but device complexity and processing time are increased
Solution Approach 1:
The shield structure around the intake hole is pre-configured to anticipate and prevent particle scattering before it occurs. The nozzle is positioned and oriented in advance to direct gas flow optimally across the substrate surface, and the shield is预先 designed to intercept any particles that might scatter. This preliminary arrangement eliminates the need for repeated cleaning passes, reducing processing time while maintaining high substrate cleanliness.
Solution Approach 2:
The patent applies local quality by positioning the nozzle and shield structure at specific locations optimized for particle removal. The shield surrounds only the intake hole area, providing localized protection without enclosing the entire substrate processing space. This selective application of the shield structure maintains substrate cleanliness where needed while minimizing interference with the overall processing flow, thus reducing processing time.
3Manufacturing precision
If gas flow is used to remove particles, then particle removal effectiveness is improved, but energy consumption increases
Solution Approach 1:
The patent uses a pneumatic system with a nozzle designed to generate high-velocity gas flow with concentrated energy. The gas flow is directed precisely at the substrate surface where particles need removal, maximizing the effectiveness of the energy applied. The shield structure around the intake hole recirculates gas flow, allowing the same gas to act on particles multiple times, thereby reducing the total energy consumption required for effective particle removal.
Solution Approach 2:
The patent controls parameters such as gas flow rate, pressure, and nozzle positioning to optimize particle removal effectiveness while minimizing energy consumption. By adjusting these parameters, the system achieves sufficient particle removal with lower energy input than would be required with higher flow rates. The shield structure further enhances energy efficiency by creating a localized flow pattern that concentrates gas energy where it is most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes contaminant particles from substrate surfaces, preventing device failures and increasing semiconductor device productivity by ensuring a clean environment for processing.
Implementation Method 1
a nozzle configured to inject a gas
Implementation Method 2
removing contaminant particles on the substrate using the particle removal device; changing an internal pressure of the substrate loading apparatus
Data Source
AI summary
A substrate loading apparatus includes a housing that provides a space where a substrate is configured to be disposed, a transfer track in the housing on an upper side of the housing, and a particle removal device connected to the transfer track. The particle removal device includes a nozzle configured to inject a gas and a module housing that has an intake hole. When viewed in plan, the intake hole surrounds the nozzle.