Substrate Removal Using Local Parting Agent Activation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the semiconductor industry, removing portions of substrates from carriers, such as grinding tapes, is challenging, especially when the substrate is diced, as the adhesive can make it difficult to separate peripheral portions without affecting the remaining substrate.
Innovation Solution
Applying a parting agent, like fluorosilicone or fluoropolymer, to the portions of the substrate to be removed, which facilitates separation when activated, typically using ultraviolet light, allowing for precise removal from the carrier without disrupting the adhesion of the remaining substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is applied to the carrier to mount the substrate, then the substrate adheres firmly to the carrier for processing, but removing portions of the substrate becomes difficult without affecting the remaining substrate adhesion
Solution Approach 1:
The patent applies a parting agent locally to specific portions of the substrate that need to be removed, while leaving other areas unaffected. This creates different adhesion properties in different locations: the treated areas become easily removable while the untreated areas maintain strong adhesion to the carrier.
Solution Approach 2:
The parting agent acts as an intermediary substance applied between the substrate and carrier. When activated, this intermediary layer facilitates separation of the substrate portion from the carrier without requiring removal of the adhesive itself, thus preserving the adhesive's effectiveness for remaining substrates.
2Productivity
If conventional adhesive methods are used to mount substrate to carrier, then substrate is securely held for processing, but peripheral portion removal is difficult without influencing remaining adhesion
Solution Approach 1:
The parting agent is applied to the substrate portions before they are mounted to the carrier. This preliminary application ensures that when activation occurs, the separation can proceed efficiently without disrupting the adhesive bonds of other substrate areas, thus improving overall processing efficiency.
Solution Approach 2:
The patent changes the adhesion parameter locally by applying and activating the parting agent. This chemical or physical modification creates a region with reduced adhesion strength, allowing easy separation of specific substrate portions while maintaining normal adhesion parameters in untreated areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and precise removal of substrate portions from carriers, improving the processing efficiency by using a parting agent that separates the substrate from the carrier without affecting the adhesion of the remaining substrate, thus addressing the difficulty in conventional methods.
Implementation Method 1
Applying a parting agent, like fluorosilicone or fluoropolymer, to the portions of the substrate to be removed, which facilitates separation when activated, typically using ultraviolet light
Data Source
AI summary
Methods and apparatuses are provided where a parting agent is applied to at least one portion of a substrate. The at least one portion of the substrate is removed from a carrier.