Substrate Transfer Path Feedback for Defect-Aware Unit Selection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In semiconductor manufacturing, the photolithography process faces inefficiencies in substrate treatment due to the lack of intelligent path selection and defect measurement feedback, leading to suboptimal use of process units and potential defects in substrate processing.

Innovation Solution

A substrate treating apparatus and method that includes a scheduler, storage, and selection module to simulate and store transfer paths, measure defect values, and apply weighting values to process units, enabling the selection of the highest priority process unit based on defect data for improved process efficiency and defect reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the earliest accessed unit and module are selected for substrate transfer, then all units can be equally used, but process results are not optimized due to lack of defect-based feedback

Engineering Contradiction:
Improveunit utilizationVSAvoidprocess result
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent implements a feedback mechanism where defect values measured from substrates are stored and used to influence subsequent process decisions. The system measures defects, stores the data, and uses this information to adjust unit selection for future substrates, creating a closed-loop system that continuously improves process results based on actual performance data.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system changes the selection criterion from simple chronological order (earliest accessed) to a defect-based priority system. By introducing defect values as a new parameter and using them to dynamically adjust unit selection priorities, the system optimizes process results while maintaining unit utilization.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If defect measurement and feedback systems are implemented, then process results are optimized, but device complexity increases

Engineering Contradiction:
Improveprocess resultVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system is divided into distinct functional modules: a measuring instrument for defect detection, a storage unit for data retention, and a control system for decision-making. This segmentation allows each component to perform its specific function independently, making the complex system more manageable and maintainable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The storage unit acts as an intermediary between the measuring instrument and the control system. It buffers and organizes defect data, allowing the control system to make informed decisions without direct real-time connection to the measurement process, thereby reducing system complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If manual path selection is used, then system operation is simple, but productivity is reduced due to suboptimal unit selection

Engineering Contradiction:
Improveoperation simplicityVSAvoidprocess efficiency
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The system performs automatic unit selection based on stored defect data, eliminating the need for manual path selection. The control system autonomously determines the optimal unit by retrieving defect values and applying selection criteria, thereby maintaining operational simplicity while significantly improving productivity through intelligent automation.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

Defect measurements are taken and stored in advance before the substrate processing decision is made. This preliminary action allows the system to have complete information available when selecting the next process unit, enabling optimal decisions without adding complexity to the real-time operation.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11809158B2Apparatus and method for treating substrate based on defect values of transfer paths
Publication Date: 2023.11.07 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US11809158B2 patent drawing
  • US11809158B2 patent drawing
  • US11809158B2 patent drawing

AI summary

A substrate treating apparatus includes a process module including a plurality of process units that perform a plurality of steps included in a substrate treating process and that perform the substrate treating process on substrates sequentially placed in the process units based on process recipes for the substrates, a scheduler that controls operations of the process module and the process units included in the process module, a storage that stores transfer paths information of the substrates, and a selection module that selects a process unit to proceed, by a result of feeding back the transfer paths information stored in the storage to the scheduler. The substrate treating apparatus may further include a measuring instrument that measures defect values of the transfer paths information along which the substrates are transferred. The storage may store the defect values measured by the measuring instrument according to the transfer paths information of the substrates.