Substrate Processing Path Partitioning for Defective Chip Replacement
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Solution Overview
Problem
Existing methods for detecting and removing defective chips on a substrate, such as micro light-emitting diodes, require lengthy scanning paths and significant computation time due to the need for re-computing an optimal path for each chip replacement.
Innovation Solution
Divide the substrate surface into multiple processed regions, perform path computation for each region separately, and generate unique processing paths for each region, allowing the processing apparatus to move to the next region after completing operations on all workpieces in one region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If whole-surface scanning is performed by the laser apparatus, then all chip positions can be detected, but the scanning path becomes relatively long and processing time increases
Solution Approach 1:
The substrate surface is divided into multiple processing regions, and the laser apparatus processes one region at a time rather than scanning the entire surface. This segmentation allows the system to focus computation and processing on smaller subsets of chips, reducing the overall scanning path length and processing time while maintaining complete defect detection coverage across all regions.
2Productivity
If an optimal path is computed for each chip replacement, then processing efficiency is improved, but computation time increases significantly
Solution Approach 1:
The computation of optimal paths is segmented by processing region rather than being performed for the entire substrate or for each individual chip replacement. This allows the system to pre-compute paths for smaller regions independently, significantly reducing the computational burden and time required while still achieving efficient processing when all regions are combined.
Solution Approach 2:
The optimal processing paths for each region are computed in advance before actual processing begins, rather than being re-computed each time a chip is replaced. This preliminary computation eliminates repeated calculation overhead during chip replacement operations, maintaining high processing efficiency while minimizing computation time.
3Measurement precision
If the laser apparatus scans all positions of chips, then defective chips can be found, but the scanning path is relatively long
Solution Approach 1:
The substrate surface is divided into multiple processing regions, and the laser apparatus processes one region at a time rather than scanning the entire surface in a single long path. This segmentation breaks the scanning path into smaller, more manageable segments, reducing the total path length while ensuring that all chip positions across all regions are still thoroughly inspected for defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces computation and processing time by up to 40% compared to conventional methods, optimizing path computation and minimizing idle running time.
Implementation Method 1
the chip may be removed from the substrate by a laser lift-off process, for example
Data Source
AI summary
A processing method of a processing apparatus is provided, including step 1, step 2, step 3, and step 4. Step 1 is providing an object having a processed surface, and dividing the processed surface into multiple processed regions, where there is at least one workpiece on each processed region. Step 2 is performing path computation according to the workpiece on each processed region, and generating a processing path in each processed region, where the processing paths in the processed regions are different from each other. Step 3 is performing processing operation by a processing apparatus according to the processing path in one of the processed regions obtained from step 2. Step 4 is moving the processing apparatus to a next processed region after finishing the processing operation on each workpiece in the one of the processed regions. A processing system is also provided.