Substrate Transport Path Control for 3D Warped Wafer Gaps
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Solution Overview
Problem
Conventional substrate transporting devices face interference issues when handling three-dimensionally warped substrates due to the inability to accurately account for the varying heights along the advancing/retreating path, leading to potential collisions between the substrate holding hand and the warped substrates.
Innovation Solution
A substrate transporting device equipped with a thickness shape information collecting unit that gathers data on the substrate's outer edge dimensions along the advancing/retreating direction, a calculation unit that determines the gap height between adjacent substrates, and a control unit that adjusts the transport path to prevent interference, ensuring safe handling of warped substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate holding hand adjusts advancing/retreating height based on transport gap (height of end face on carry-in/out port side), then the transport gap measurement is simple, but the substrate holding hand interferes with three-dimensionally warped substrates during transport
Solution Approach 1:
The invention transitions from measuring only the end face height (one-dimensional measurement at carry-in/out port side) to measuring heights at multiple positions including the far side of the substrate (multi-dimensional measurement along the advancing/retreating direction). This dimensional expansion enables accurate detection of three-dimensional warpage, allowing the substrate holding hand to adjust its path and avoid interference with warped substrates during transport
2Ease of operation
If the substrate holding hand uses fixed advancing/retreating height, then the transport control is simple, but the substrate holding hand cannot adapt to varying substrate heights due to warpage
Solution Approach 1:
The invention performs preliminary measurement of substrate heights at multiple positions (including end face and far side) before the transport operation. Based on these pre-acquired height information and calculated transport gaps, the substrate holding hand's advancing/retreating path is pre-adjusted to match the actual substrate top surface position, preventing interference before transport begins
Solution Approach 2:
The invention implements a feedback mechanism where height information from multiple substrate positions is continuously acquired, transport gaps are calculated based on this feedback, and the substrate holding hand's transport path is dynamically adjusted accordingly. This closed-loop control enables real-time adaptation to substrate warpage variations
Data Source
AI summary
A substrate transporting device includes the following elements. A substrate transporting device includes a transporting unit having a holding hand that holds the substrate, and being configured to transport the substrate by advancing/retreating the holding hand from the carry-in/out port of the accommodating container to a gap between the substrates; a thickness shape information collecting unit configured to collect thickness shape information based on an outer edge of the substrate for each substrate while the substrate is accommodated in the accommodating container; a calculation unit configured to calculate height information of a gap between two vertically adjacent substrates to which the holding hand advances/retreats based on the thickness shape information of the two substrates when the transporting unit carries-in/out the substrates to/from the accommodating container; and a control unit configured to control transport of the transporting unit based on the height information.