Substrate Pattern Surface Treatment for Preventing Collapse
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Solution Overview
Problem
Conventional methods for preventing pattern collapse on semiconductor substrates are inadequate in imparting sufficient water repellency and are complex to implement.
Innovation Solution
A method involving a two-step chemical processing of the substrate, where the first step uses a silane coupling agent with a Hansen solubility parameter of 15 or more, and the second step employs an anionic or amphoteric surfactant to impart high water repellency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface processing methods are used to impart water repellency, then some water repellency is achieved, but the water repellency is insufficient and the process is complex
Solution Approach 1:
The conventional single-step surface processing is segmented into two distinct steps: first applying a silane coupling agent solution to create a hydrophobic base layer, then applying a fluorinated surfactant solution to enhance water repellency. This segmentation allows each step to perform its specific function optimally, achieving sufficient water repellency while maintaining process simplicity through clear division of functional tasks.
Solution Approach 2:
The invention uses a composite approach by combining two different chemical substances with complementary properties: a silane coupling agent that provides hydrophobicity and adhesion, and a fluorinated surfactant that enhances water repellency. This composite material strategy on the substrate surface achieves superior water repellency compared to using either substance alone, while the sequential application keeps the process manageable.
2Ease of manufacture
If patterns are cleaned or rinsed, then cleaning is achieved, but patterns are prone to stick together and collapse
Solution Approach 1:
The water repellent treatment is applied as a preliminary action before the cleaning or rinsing steps. By pre-establishing the hydrophobic and water-repellent properties on the pattern surfaces, the patterns are protected against sticking together during subsequent cleaning operations, thus maintaining pattern stability while still allowing effective cleaning to occur.
Solution Approach 2:
The invention applies preliminary anti-action by creating water-repellent surfaces that preemptively counteract the harmful effect of pattern sticking during cleaning. The hydrophobic and water-repellent coatings prevent the capillary forces and adhesion that would otherwise cause patterns to stick and collapse during wet cleaning or rinsing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents pattern collapse by making the substrate surface water repellent, thereby reducing the likelihood of patterns sticking together and collapsing during the drying process.
Implementation Method 1
a first step for processing the surface of the pattern with a first chemical solution, the first chemical solution including a silane coupling agent that has a SP value of Hansen solubility parameter of 15 or more
Implementation Method 2
a second step for processing the surface of the pattern with a second chemical solution after the first step, the second chemical solution including an anionic or amphoteric surfactant
Data Source
AI summary
There are provided a method for processing a substrate in which a surface of a pattern on a substrate is processed, the method including: a first step for processing the surface of the pattern with a first chemical solution, the first chemical solution including a silane coupling agent that has a SP value of Hansen solubility parameter of 15 or more; and a second step for processing the surface of the pattern with a second chemical solution after the first step, the second chemical solution including an anionic or amphoteric surfactant; a kit for processing a substrate; and a method for manufacturing a semiconductor substrate.