Substrate-Conductive Pattern Layout for Heat and Warpage Control
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Solution Overview
Problem
Electronic devices face challenges with heat dissipation, resistive-capacitive loading, and warpage, which are not adequately addressed by existing technologies.
Innovation Solution
The electronic device incorporates a substrate structure with a driving component and a conductive pattern, where the conductive pattern thickness ranges from 0.5 μm to 15 μm, designed to dissipate heat, increase heat dissipation area, and reduce resistive-capacitive loading by separating the driving component and conductive pattern on different substrates with an adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the conductive pattern thickness is increased to improve heat dissipation, then heat dissipation performance is improved, but resistive-capacitive loading increases
Solution Approach 1:
The conductive pattern is divided into multiple sub-conductive patterns arranged in parallel. Each sub-conductive pattern has a thickness between 0.5 μm to 15 μm, and by distributing the current across multiple patterns, the patent reduces the resistive-capacitive loading while maintaining adequate heat dissipation through the collective thermal conductivity of all patterns.
2Device complexity
If the driving component and conductive pattern are placed on the same substrate, then device complexity is reduced, but warpage occurs due to thermal expansion differences
Solution Approach 1:
The device is segmented into separate substrate structures: the driving component is formed on a first substrate while the conductive pattern is formed on a second substrate. This physical separation prevents warpage caused by differential thermal expansion between components on the same substrate, while still allowing electrical connection through conductive vias or bumps between the substrates.
Solution Approach 2:
An adhesive layer or bonding interface acts as an intermediary between the first substrate (carrying driving components) and the second substrate (carrying conductive patterns). This intermediary layer accommodates thermal expansion differences and mechanical stress, preventing warpage while maintaining structural integrity and electrical connectivity.
3Object-generated harmful factors
If the conductive pattern thickness is increased to reduce resistive-capacitive loading, then electrical performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
Rather than requiring a single thick conductive pattern with precise thickness control, the patent uses multiple thinner sub-conductive patterns (each 0.5 μm to 15 μm thick) arranged in parallel. This segmentation relaxes the manufacturing precision requirements for individual pattern thickness while achieving the same or better electrical performance through distributed current paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, improves warpage issues, and reduces resistive-capacitive loading, resulting in improved performance and efficiency of the electronic device.
Implementation Method 1
a thickness of the conductive pattern is greater than or equal to 0.5 μm and less than or equal to 15 μm... designed to dissipate heat, increase heat dissipation area
Implementation Method 2
separating the driving component and conductive pattern on different substrates with an adhesive layer
Data Source
AI summary
The disclosure provides an electronic device which includes a substrate structure, a driving component, and a conductive pattern. The driving component and the conductive pattern are formed on the substrate structure, and the thickness of the conductive pattern is greater than or equal to 0.5 μm and less than or equal to 15 μm.