Substrate Patterning by Reusable Raised-Element Etch Mask
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Solution Overview
Problem
The existing methods for forming patterns on substrates for microelectronic component manufacturing are costly and time-consuming, particularly due to the complex resin stripping process in photolithography.
Innovation Solution
A method involving bonding a handle substrate with raised elements to a substrate of interest with a thin film sensitive to an etchant, followed by wet or gaseous etching to create raised patterns, and then separating the handle substrate, thereby simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography with resin spreading, exposure, developing, etching and stripping is used to form patterns on substrate, then pattern formation is achieved, but the process duration and cost increase significantly
Solution Approach 1:
The patent extracts and eliminates the photolithography steps (resin spreading, exposure, developing, stripping) from the pattern formation process. Instead, it uses a simplified approach where a mask layer is deposited on the substrate, and etching is performed directly through the mask material to create the desired patterns, removing the time-consuming resin-based photolithography sequence while maintaining pattern formation capability
Solution Approach 2:
The patent uses a mask layer that is deposited onto the substrate to copy the desired pattern geometry. The mask layer serves as a template that defines the pattern shape, and the etching process transfers this pattern from the mask layer to the underlying substrate material, achieving pattern formation without photolithography
2Manufacturing precision
If photolithography with resin spreading, exposure, developing, etching and stripping is used to form patterns on substrate, then pattern formation is achieved, but manufacturing cost increases due to resin, solvents and cleaning solutions
Solution Approach 1:
The patent extracts and eliminates the expensive photolithography materials (resins, solvents, cleaning solutions) from the manufacturing process. The method replaces these consumable materials with a reusable mask layer that can be deposited once and used repeatedly for pattern formation, significantly reducing material costs
Solution Approach 2:
The mask layer used in this patent can be recovered and reused for multiple pattern formation cycles. Instead of being discarded after a single use like photolithography resins, the mask layer remains on the substrate and can serve as the pattern definition for subsequent processing steps or be reused on other substrates, reducing overall manufacturing cost
3Manufacturing precision
If photolithography with resin spreading, exposure, developing, etching and stripping is used to form patterns on substrate, then pattern formation is achieved, but process complexity increases due to multiple steps
Solution Approach 1:
The patent merges multiple separate photolithography steps (resin spreading, exposure, developing, etching, stripping) into a single integrated process. The mask layer deposition and direct etching through the mask combines what were previously distinct sequential operations, reducing process complexity while maintaining pattern formation precision
Solution Approach 2:
Instead of using photolithography to create a temporary resin pattern that is then stripped away, the patent inverts the approach by depositing a permanent or reusable mask layer that remains on the substrate. The pattern definition function is achieved not by creating and removing a temporary structure, but by using a stable mask that can guide the etching process directly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the duration and cost of pattern formation by eliminating the need for photolithography steps and allowing for the reuse of the handle substrate, thereby enhancing process efficiency and reducing material usage.
Implementation Method 1
performing a wet or gaseous etching with the etchant to remove the material sensitive to the etchant present in the first areas
Implementation Method 2
performing a wet or gaseous etching with the etchant to remove the material sensitive to the etchant present in the first areas
Implementation Method 3
bonding a handle substrate to a substrate of interest
Data Source
AI summary
A method comprising the following steps: a) bonding a handle substrate including a base and raised elements to a substrate of interest including a support substrate covered with a thin film, the thin film including a material sensitive to an etchant, whereby the thin film includes first areas not covered with the raised elements and second areas covered with the raised elements, b) performing an etching with the etchant to remove the material sensitive to the etchant present in the first areas, the second areas being protected during the etching, whereby the thin film is structured in the form of raised patterns, c) separating the handle substrate from the substrate of interest.