Package Substrate Pedestals for Deep Trench Capacitor Alignment
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Solution Overview
Problem
The thickness mismatch between deep trench capacitors and substrate cores in semiconductor packages leads to misalignment and processing challenges during embedding, causing misalignments and mechanical stress due to the use of adhesives and encapsulants.
Innovation Solution
A pedestal or spacer is used to fill the cavity and support the deep trench capacitor at a suitable height and location relative to the core, ensuring alignment and reducing mechanical stress by matching the thickness of the semiconductor component assembly to the cavity height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If deep trench capacitors are embedded directly in substrate cores, then manufacturing process is simplified, but thickness mismatch causes misalignment and mechanical stress
Solution Approach 1:
A pedestal structure is introduced as an intermediary component between the deep trench capacitor and the substrate core. The pedestal has a first surface that contacts the capacitor and a second surface that contacts the substrate core, acting as a mediator that bridges the thickness mismatch. This allows the capacitor to be positioned at the correct height while maintaining proper alignment with the substrate core, thereby resolving both the alignment precision issue and maintaining manufacturing simplicity.
2Manufacturing precision
If adhesives and encapsulants are used to compensate for thickness mismatch, then alignment can be achieved, but mechanical stress increases
Solution Approach 1:
The pedestal serves as a mechanical intermediary that provides a stable, stress-distributing interface between the capacitor and substrate core. By contactingly supporting the capacitor on its first surface and being supported by the substrate core on its second surface, the pedestal distributes mechanical loads more evenly than adhesives alone, reducing localized stress concentrations while maintaining alignment precision.
Solution Approach 2:
The pedestal changes the mechanical parameter of the assembly by providing a rigid support structure with appropriate mechanical properties. This structural parameter change reduces the reliance on adhesives for mechanical support, thereby reducing the mechanical stress and strain in the overall assembly while maintaining proper positioning.
3Manufacturing precision
If pedestal is used to match thickness, then alignment and mechanical stress are improved, but device complexity increases
Solution Approach 1:
The pedestal is segmented into distinct functional surfaces: a first surface for contacting the deep trench capacitor and a second surface for contacting the substrate core. This segmentation allows each surface to be optimized for its specific function - the first surface provides stable support for the capacitor while the second surface provides proper interface with the substrate core, achieving alignment precision without excessive overall complexity.
Data Source
AI summary
Pedestals for semiconductors embedded in package substrates and related methods are disclosed. An example package substrate for an integrated circuit package disclosed herein includes core having a first surface, a second surface, and a cavity formed in the first surface, a semiconductor component disposed in the cavity, and a pedestal disposed in the cavity, the pedestal having a third surface coupled to the semiconductor component, and a fourth surface adjacent to the first surface, the pedestal dimensioned such that a first thickness of the pedestal and semiconductor is substantially equal to a second thickness of the core.