Substrate Peeling Film Interface for Hydrophobic Surface Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing methods face challenges in effectively peeling off processing films from hydrophobic surfaces due to interaction between the hydrophobic surface and hydrophobic groups in the processing film, leading to incomplete removal of objects from the substrate.
Innovation Solution
A substrate processing method involving the formation of a hydrophilic film on the substrate surface, followed by reduction of its thickness, and then forming a processing film to hold the removal object, allowing for the peeling off of the processing film using a peeling liquid, which can penetrate the interface between the hydrophilic film and the processing film, facilitating the removal of objects regardless of the substrate's surface hydrophobicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a processing film is formed directly on a hydrophobic substrate surface, then the processing film can be formed easily, but the peeling liquid cannot penetrate effectively between the substrate and processing film due to hydrophobic interaction, resulting in incomplete removal of objects
Solution Approach 1:
A hydrophilic film is introduced as an intermediary layer between the hydrophobic substrate surface and the processing film. This intermediate layer mediates the interaction by providing a hydrophilic interface that allows effective penetration of the peeling liquid, while still maintaining good adhesion to both the substrate and the processing film, thus resolving the contradiction between easy film formation and effective peeling.
Solution Approach 2:
The structure employs a composite configuration consisting of three distinct layers: the hydrophobic substrate, the hydrophilic film layer, and the processing film. This composite structure combines the advantages of hydrophobic substrate adhesion with hydrophilic peeling liquid penetration, achieving both easy processing film formation and reliable peeling efficiency.
2Stability of the object's composition
If the substrate surface is hydrophobic, then the substrate maintains its original surface properties, but the entry of peeling liquid is impeded by hydrophobic interaction with the processing film
Solution Approach 1:
The hydrophilic film serves as a mediator that preserves the substrate's original hydrophobic surface properties while creating a hydrophilic interface for peeling liquid entry. The intermediary layer does not alter the substrate's chemical state but provides the necessary hydrophilic characteristics at the processing interface.
Solution Approach 2:
The hydrophilic film introduces local quality differentiation: the region in contact with the substrate maintains hydrophobic characteristics (preserving substrate properties), while the region interfacing with the processing film exhibits hydrophilic properties (enabling peeling liquid penetration). This local differentiation resolves the contradiction between surface stability and peeling ease.
3Reliability
If a thick hydrophilic film is formed on the substrate, then the substrate surface is effectively hydrophilized, but the removal object cannot be exposed sufficiently for effective processing
Solution Approach 1:
The thickness of the hydrophilic film is precisely controlled as a critical parameter. By optimizing the film thickness to a specific range, the solution achieves sufficient hydrophilicity for effective peeling liquid penetration while maintaining adequate exposure of the removal object. This parameter optimization resolves the contradiction between surface hydrophilicity and object exposure precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures satisfactory removal of objects from the substrate by enhancing the peeling efficiency and maintaining the substrate's surface properties, allowing for effective peeling even on hydrophobic surfaces without altering the substrate's chemical state.
Implementation Method 1
supplying, toward a major surface of a substrate, a hydrophilic film forming liquid to form a hydrophilic film on the major surface of the substrate
Implementation Method 2
supplying, toward the major surface of the substrate, a film thickness reducing liquid that dissolves the hydrophilic film to reduce a thickness of the hydrophilic film
Implementation Method 3
supplying, toward the major surface of the substrate after the thickness of the hydrophilic film has been reduced, a processing film forming liquid to form, on a front surface of the hydrophilic film, a processing film
Implementation Method 4
supplying, toward the major surface of the substrate, a peeling liquid to peel off the processing film from the hydrophilic film
Implementation Method 5
The peeling liquid may be an alkaline liquid
Data Source
AI summary
A substrate processing method includes a hydrophilic film forming liquid supplying step of supplying, toward a major surface of a substrate, a hydrophilic film forming liquid to form a hydrophilic film on the major surface, a film thickness reducing liquid supplying step of supplying, toward the major surface, a film thickness reducing liquid to reduce a thickness of the hydrophilic film, a processing film forming liquid supplying step of supplying, toward the major after the thickness of the hydrophilic film has been reduced, a processing film forming liquid to form, on a front surface of the hydrophilic film, a processing film that holds a removal object present on the major surface, and a peeling liquid supplying step of supplying, toward the major surface, a peeling liquid to peel off the processing film from the hydrophilic film.