Semiconductor Table Pressure Layout for Thin Substrate Peeling
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in optimizing dicing conditions and pickup conditions due to issues like burr formation, adhesive member deformation, and difficulty in peeling off substrates, especially for thinner substrates.
Innovation Solution
A semiconductor manufacturing device with a table having first and second through holes and a container with a joint, allowing for decompression of the through holes and pressurization of the container to facilitate peeling of the adhesive member from the substrate, particularly from burrs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate thickness is reduced to improve device performance, then the substrate becomes more susceptible to deformation and harder to handle, but reducing thickness improves device performance and integration density
Solution Approach 1:
The adhesive member serves as an intermediary between the substrate and the annular frame, providing mechanical support and stabilization to thin substrates during handling and processing. This mediator enables the substrate to maintain structural integrity even at reduced thicknesses of 75 μm or less
Solution Approach 2:
The invention changes the physical state and properties of the adhesive member through temperature control and pressure application. By heating the adhesive member to a glass transition temperature and applying pressure, the adhesive's viscosity and bonding characteristics are modified, enabling effective bonding and subsequent peeling of thin substrates
2Ease of operation
If the adhesive member is heated to promote peeling, then peeling efficiency improves, but thermal damage to the substrate may occur
Solution Approach 1:
Heating is applied locally and selectively to the adhesive member rather than uniformly to the entire substrate assembly. The pressure application device concentrates thermal and mechanical energy at the adhesive-substrate interface, promoting peeling while minimizing thermal exposure to the substrate itself
Solution Approach 2:
The adhesive member's glass transition temperature is exploited as a critical parameter. By controlling the heating process to reach this specific temperature threshold, the adhesive's physical properties change, enabling easy peeling. The process parameters (temperature, pressure, time) are optimized to achieve peeling without substrate damage
3Ease of operation
If pressure is applied to the adhesive member to improve peeling, then peeling effectiveness increases, but substrate deformation may occur
Solution Approach 1:
The substrate is first firmly bonded to the annular frame using the adhesive member in a preliminary bonding step. This preliminary fixation provides structural support that prevents substrate deformation during subsequent pressure application for peeling operations
Solution Approach 2:
Pressure is applied as a controlled parameter in conjunction with temperature. The combination of elevated temperature (softening the adhesive) and controlled pressure creates optimal peeling conditions while the annular frame provides mechanical constraints that prevent excessive substrate deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables easier optimization of dicing and pickup conditions by promoting adhesive member peeling, reducing substrate deformation, and improving handling efficiency, especially for substrates with thicknesses of 75 μm or less.
Implementation Method 1
decompressing the first through holes, decompressing the second through holes
Implementation Method 2
pressurizing an inside of the container using the joint
Data Source
AI summary
A semiconductor manufacturing device includes a table having an upper face on which a frame having a first opening to which a substrate is fixed by an adhesive is disposed, the table having a plurality of first through holes penetrating the table in a vertical direction and provided side by side in a first direction parallel to the upper face and a plurality of second through holes each provided between the adjacent first through holes and penetrating the table in the vertical direction; and a container provided on the table, the container including a first sidewall provided on the frame, a second sidewall provided on the frame, the second sidewall facing the first sidewall, a distance between the second sidewall and the first sidewall being larger than a first inner diameter of the first opening, and a joint allowing an outside of the container and an inside of the container to communicate with each other.