Substrate Peeling Table With Pressure-Controlled Adhesive Release
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in efficiently peeling substrates from adhesive members due to burrs and substrate thickness, leading to difficulties in optimizing dicing and pickup conditions, particularly for thin substrates with metal electrodes.
Innovation Solution
A semiconductor manufacturing device with a table featuring through holes and a container configuration that decompresses and pressurizes specific areas to facilitate peeling of substrates from adhesive members, utilizing a container with a larger opening to engage with the annular frame and a joint for internal pressure application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dicing conditions are optimized for thin substrates with metal electrodes, then substrate damage is reduced, but peeling difficulty increases due to adhesive residue on burrs
Solution Approach 1:
The patent extracts and removes the adhesive member from the system by implementing a peeling process that detaches the adhesive from both the substrate and the dicing blade burrs. The peeling unit specifically targets and removes adhesive residue that would otherwise contaminate the substrate or tooling, enabling clean separation of the diced substrates from the tape.
Solution Approach 2:
The patent introduces a peeling unit as an intermediary mechanism between the dicing process and substrate pickup. This unit acts as a mediator that facilitates the separation process by mechanically removing the adhesive bond, allowing substrates to be peeled cleanly without direct contact between the pickup tool and adhesive-contaminated burrs.
2Manufacturing precision
If adhesive strength is increased to prevent substrate movement during dicing, then dicing precision improves, but peeling difficulty increases
Solution Approach 1:
The peeling unit serves as an intermediary that breaks the strong adhesive bond between the substrate and tape. By introducing this dedicated peeling mechanism, the system can use sufficiently strong adhesive for stable dicing while still enabling controlled peeling through the intermediary peeling unit that mechanically detaches the adhesive.
Solution Approach 2:
The peeling process extracts and removes the adhesive member from the substrate surface. By actively removing rather than simply breaking the adhesive bond, the system can maintain strong adhesion during dicing while enabling clean separation during peeling, effectively decoupling the requirements for holding strength and release ease.
3Productivity
If substrate thickness is reduced for advanced device applications, then device performance improves, but peeling reliability deteriorates due to increased susceptibility to damage
Solution Approach 1:
The peeling unit acts as a protective intermediary that handles thin substrates during the peeling process. By providing a controlled mechanical separation mechanism, it prevents direct stress concentration on thin substrates that would occur during conventional peeling, thereby maintaining peeling reliability for thicknesses down to 50 μm or less.
Solution Approach 2:
The patent converts the potential harm of thin substrate fragility into a benefit by implementing a specialized peeling process that accounts for reduced mechanical strength. The peeling unit's design specifically addresses thin substrate characteristics, turning the vulnerability into an opportunity for optimized handling that ensures reliable peeling despite the reduced thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the peeling process by promoting adhesive member detachment from burrs and substrates, allowing for optimized dicing and pickup conditions without considering both simultaneously, especially beneficial for thin substrates.
Implementation Method 1
decompressing the first through holes and the second through holes
Implementation Method 2
pressurizing an interior of the container
Data Source
AI summary
A semiconductor manufacturing device includes a table having an upper face on which a frame having a first opening to which a substrate is fixed by an adhesive is disposed, the table having a plurality of first through holes penetrating the table in a vertical direction and provided side by side in a first direction parallel to the upper face and a plurality of second through holes each provided between the adjacent first through holes and penetrating the table in the vertical direction; and a container provided on the table, the container including a first sidewall provided on the frame, a second sidewall provided on the frame, the second sidewall facing the first sidewall, a distance between the second sidewall and the first sidewall being larger than a first inner diameter of the first opening, and a joint allowing an outside of the container and an inside of the container to communicate with each other.