Substrate Peripheral Metal-Film Removal Before Transport Gripping
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Solution Overview
Problem
In the lithography process for semiconductor device manufacturing, metal-containing coating films on substrates are difficult to remove from the peripheral areas without contaminating the substrate processing apparatus and adjacent exposure devices, as the metal components remain after attempting to dissolve the coating films with organic solvents.
Innovation Solution
A substrate processing apparatus is designed with a film formation unit that applies a metal-containing coating liquid, followed by a peripheral portion removal unit that uses a specific removal liquid to dissolve the metal from the peripheral areas, ensuring the metal-containing coating film remains only on the substrate's surface, preventing contamination by transporting the substrate to a unit that supplies a first removal liquid to the peripheral areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If organic solvent is discharged to the peripheral portion to remove the coating film, then the coating film is dissolved, but metal component remains and causes contamination
Solution Approach 1:
The invention changes the chemical parameter of the removal liquid from organic solvent to aqueous solution, which fundamentally alters the dissolution mechanism. The aqueous solution effectively removes metal components that organic solvents cannot dissolve, thereby eliminating metal contamination while maintaining coating film removal capability
Solution Approach 2:
The invention replaces the chemical mechanism of organic solvent dissolution with an aqueous-based chemical mechanism. This substitution allows for effective metal component removal through aqueous chemistry rather than organic solvent action, solving the contamination problem
2Ease of operation
If transport mechanism grips the peripheral portion of substrate, then substrate can be transported, but resist film is stripped and becomes particles
Solution Approach 1:
The invention performs preliminary removal of the coating film from the peripheral portion using aqueous solution before the substrate is gripped by the transport mechanism. This preliminary action ensures that when the transport mechanism grips the peripheral portion, no coating film remains to be stripped and form particles
Solution Approach 2:
The invention converts the potential harm of peripheral portion processing into a benefit by using the same peripheral region that causes problems during transport as the target for preliminary coating film removal. The aqueous solution treatment transforms the problematic area into a clean zone that prevents particle generation during subsequent transport operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents metal contamination by ensuring the metal-containing coating film is formed only on the substrate's surface, avoiding adherence to transport mechanisms and maintaining apparatus cleanliness.
Implementation Method 1
supplies a first removal liquid for dissolving the metal to a peripheral portion of the substrate such that the metal-containing coating film remains in a region except for the peripheral portion
Data Source
AI summary
A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.