Semiconductor Substrate Pillar Interconnections for Die Footprint Utilization
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Solution Overview
Problem
In semiconductor packaging, the conductive pillars beneath or upon which the semiconductor die is mounted are not utilized due to being covered by the die, limiting their functionality.
Innovation Solution
A substrate with a uniform array of conductive pillars extending from the top to the bottom surface, allowing electrical connection between pillars under the die footprint and those outside, using bond wires to establish electrical contact with the die's pads, enabling the pillars beneath the die to be used for interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the semiconductor die is mounted on the pillars to form a packaged device, then the device structure is completed and protected by encapsulation, but the pillars beneath the die cannot be used for electrical connections
Solution Approach 1:
The patent utilizes the vertical dimension by routing bond wires from the top surface (where die pads are located) down through the substrate to connect to pillars at the bottom surface. This three-dimensional wire routing approach allows pillars beneath the die footprint to be accessed and utilized, transforming the unused vertical space into functional interconnection pathways.
Solution Approach 2:
The substrate acts as an intermediary element that facilitates connections between the die pads on top and the pillars at the bottom. By introducing bond wires that traverse through the substrate, the system creates an intermediate connection path that enables electrical contact between previously inaccessible pillars and the active circuit elements.
2Productivity
If bond wires are used to connect die pads to pillars outside the die footprint, then pillars beneath the die can be utilized, but the packaging process becomes more complex
Solution Approach 1:
The uniform array of pillars serves multiple functions: pillars outside the die footprint serve as both mechanical support structures and electrical interconnection points. This multi-functionality allows the same pillar structure to provide both structural integrity and electrical connectivity, reducing the need for additional dedicated connection elements and improving overall packaging efficiency.
Solution Approach 2:
The pillars are pre-formed in a uniform array pattern within the substrate before die mounting. This preliminary structuring of the interconnection infrastructure allows for systematic and efficient wire bonding operations, as the target connection points are already positioned and configured, streamlining the subsequent packaging process.
Data Source
AI summary
A “universal” substrate for a semiconductor device is formed of a non-conductive substrate material. A uniform array of conductive pillars is formed in the substrate material. The pillars extend from a top surface of the substrate material to a bottom surface of the substrate material. A die flag may be formed on the top surface of the substrate material. Pillars underneath the die flag are connected to pillars beyond a perimeter of the die flag with wires. Power and ground rings may be formed by connecting rows of pillars that surround the die flag.