Substrate Support Pin Resistance Control for ESD-Safe Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, the existing methods for adjusting the charge on substrates during cleaning are inadequate, leading to variations in etching rate, thickness, and edge quality due to uncontrolled ground resistance and indiscriminate charge escape, which can result in electrostatic discharge (ESD) and difficulties in monitoring electrostatic forces.
Innovation Solution
A substrate supporting member with a charge control device that uses variable resistors to control the electrical connections between support pins and guide pins, allowing precise adjustment of charge flow by switching and connecting resistors in series or parallel to manage ground resistance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If guide pin and support pin are grounded to adjust charge on substrate, then charge control is achieved, but ground resistance cannot be controlled and charges escape indiscriminately
Solution Approach 1:
The patent applies dynamics by making the ground resistance value adjustable rather than fixed. The control unit dynamically changes the ground resistance value of the guide pin and support pin based on process requirements, allowing the system to adapt charge dissipation characteristics to different cleaning conditions and substrate states.
Solution Approach 2:
The patent changes the electrical parameter (ground resistance value) of the guide pin and support pin from a fixed grounded state to a variable resistance state. By adjusting the ground resistance value, the system controls charge flow rate and dissipation characteristics, preventing indiscriminate charge escape while maintaining reliable charge control.
2Reliability
If aluminum plate is added inside chuck to connect guide pin, then electrical connection is achieved, but device structure becomes more complex
Solution Approach 1:
The guide pin and support pin serve dual functions: they provide mechanical support for the substrate and simultaneously control charge dissipation through adjustable ground resistance. This eliminates the need for separate aluminum plates or dedicated electrical connection components, reducing structural complexity while maintaining reliable electrical connection.
Solution Approach 2:
The patent merges the mechanical support function and electrical charge control function into the same components (guide pin and support pin). By integrating these functions, the system avoids adding separate aluminum plates or electrical connection structures, thereby reducing overall device complexity.
3Ease of manufacture
If guide pin material varies, then manufacturing flexibility is improved, but etching rate deviation and thickness variation occur
Solution Approach 1:
The patent changes the electrical parameter (ground resistance value) of the guide pin to control charge dissipation characteristics. This parameter adjustment compensates for variations in guide pin material properties, ensuring consistent etching rate and thickness control regardless of the specific material used, thereby maintaining manufacturing precision while allowing manufacturing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient adjustment of charge flow on substrates, preventing ESD and improving etching rate and edge quality by controlling ground resistance values, thereby enhancing the substrate treating process.
Implementation Method 1
A substrate supporting member with a charge control device that uses variable resistors to control the electrical connections between support pins and guide pins, allowing precise adjustment of charge flow by switching and connecting resistors in series or parallel to manage ground resistance values
Data Source
AI summary
A substrate supporting member capable of controlling the flow of charges on a substrate by controlling ground resistance values of a guide pin and a support pin using a variable resistor, and a substrate treating apparatus including the same are provided. The substrate supporting member includes the body; a support pin installed on the body and for supporting the substrate; a guide pin installed on the body and for supporting the substrate; and a charge control device for controlling a charge around the substrate by controlling an electrical connection between the support pin and a first resistor and an electrical connection between the guide pin and a second resistor.