Substrate Support Pin Spacing for Uniform Backside Processing
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Solution Overview
Problem
Conventional substrate processing apparatuses suffer from process non-uniformity due to constant contact between support pins and the substrate during etching or cleaning, leading to inadequate liquid invasion and subsequent process issues.
Innovation Solution
A substrate processing apparatus with a support pin spacing device that elevates and lowers support pins relative to the chuck pins, allowing for selective contact and spacing during processing to improve uniformity, featuring a controller for process-specific adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If support pins are always in contact with the substrate during processing, then the substrate is stably supported, but process uniformity deteriorates due to insufficient liquid invasion at contact portions
Solution Approach 1:
The support pins are designed to be movable rather than fixed, allowing them to dynamically adjust their position. During substrate loading, the pins contact the substrate to provide stable support. During processing, the pins are lowered to create spacing that enables liquid invasion. This dynamic positioning resolves the contradiction between maintaining support stability and achieving process uniformity.
Solution Approach 2:
The support pins perform periodic actions: first contacting the substrate to provide stable support during loading, then lowering to create spacing during processing, and finally returning to contact position after processing. This periodic switching between contact and spacing states allows the system to achieve both stable support and process uniformity at different stages.
2Device complexity
If support pins remain fixed during processing, then the device structure is simple, but liquid invasion is insufficient causing process non-uniformity
Solution Approach 1:
The support pins are designed with movable structures that allow them to change position vertically. Each support pin can be lowered independently or collectively to create spacing between the substrate and the pin contact points during processing. This dynamic capability enables liquid to invade the contact portions uniformly, resolving the process uniformity issue while adding only moderate structural complexity through elevating/lowering mechanisms.
Data Source
AI summary
Disclosed are a substrate processing apparatus and a substrate processing method capable of improving processing uniformity of a substrate. The substrate processing apparatus includes a body configured to spin-rotate; a plurality of support pins installed on the body so as to support the substrate thereon; a plurality of chuck pins installed on the body so as to grip a side surface of the substrate; a chuck pin driver device configured to move the chuck pin from a stand-by position to a grip position when the substrate has been seated on the support pin; and a support pin spacing device configured to space the substrate and at least one of the support pins from each other while the chuck pin is gripping the substrate.