Substrate Support Pin Structure for Stage Thermal Expansion
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining in-plane uniformity of substrate temperature due to thermal expansion and contraction, which can damage substrate support pins and impair processing uniformity.
Innovation Solution
A substrate processing apparatus with a stage featuring through-holes for substrate support pins, where the pins have a large diameter portion below a protrusion and a support member engages with this portion, allowing vertical movement without fixing to the stage bottom, thus preventing positional deviation and maintaining temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If substrate support pins are fixed to the stage bottom, then positional stability is improved, but thermal expansion and contraction cause damage to the pins and impair processing uniformity
Solution Approach 1:
The substrate support pin is designed with a movable structure that allows vertical movement relative to the stage. The pin can move up and down within the through-hole to accommodate thermal expansion and contraction of the stage, preventing damage while maintaining positional stability during substrate processing
Solution Approach 2:
The substrate support pin is divided into multiple sections: a protrusion that protrudes from the stage upper surface, a large diameter portion below the protrusion, and a thin-walled section. This segmentation allows different parts of the pin to serve different functions - the protrusion supports the substrate, while the movable large diameter portion accommodates thermal movement
2Reliability
If substrate support pins are made movable to prevent thermal damage, then reliability is improved, but positional deviation may occur affecting processing precision
Solution Approach 1:
The pin structure has different local properties: the protrusion and large diameter portion provide stable support and engagement, while the thin-walled section allows controlled movement. This local differentiation enables the pin to move vertically for thermal compensation while maintaining horizontal positioning precision for substrate processing
3Ease of operation
If the stage structure includes through-holes and lateral holes for pin support, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The stage structure integrates multiple functions into a unified design: the through-hole provides pin insertion and vertical movement space, the lateral hole accommodates the support member, and the recess at the upper opening end provides additional support. This merging of functions reduces the need for separate components while maintaining ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances in-plane temperature uniformity of substrates during heating or cooling, prevents damage to support pins, and allows for smooth operation without compromising the substrate transfer process.
Implementation Method 1
at least one of heating and cooling being performed on the substrate
Data Source
AI summary
A substrate processing apparatus for processing a substrate, includes a stage including a through-hole vertically penetrating the stage, a pin inserted into the through-hole, and a support member configured to support the pin. The pin has a protrusion configured to protrude from the upper surface of the stage through the through-hole, and a large diameter portion located below the protrusion and formed thicker than the protrusion. The stage further includes a lateral hole formed to extend from a side surface of the stage so as to intersect with the through-hole. The support member is inserted into the lateral hole. The support member is configured to support the pin by an engagement with the large diameter portion while the support member is inserted into the lateral hole. An upper opening end of the through-hole is thinner than the large diameter portion.