Substrate Support Pin Assembly for Alignment and Zoned Heat Control
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Solution Overview
Problem
Conventional plasma process facilities face challenges in achieving fine etching control, target deterioration, and reduced unit per equipment hour (UPEH) due to complex device configurations and substrate deviation during lift and heat treatment processes, along with local temperature differences on substrates.
Innovation Solution
A substrate support unit with integrated pin assemblies that include lift pins and guide tips to stabilize substrate position, combined with a heat source unit that divides heat supply regions and a cooling unit to control gas flow and temperature, allowing efficient plasma and heat treatment processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If separate lift pin and alignment pin are provided, then substrate lifting and alignment functions are achieved, but device configuration becomes complicated
Solution Approach 1:
The patent combines the lift pin and alignment pin into a single integrated pin structure. The pin includes a lifting portion that contacts the substrate bottom surface for lifting, and a guide portion that contacts the substrate side surface for alignment. This integration eliminates the need for separate components while maintaining both lifting and alignment functions, thereby simplifying the device configuration.
2Temperature
If uniform heat source is supplied to entire substrate area, then heat treatment is applied, but local temperature difference occurs on substrate
Solution Approach 1:
The patent divides the heat treatment system into multiple independent heating zones corresponding to different regions of the substrate. Each heating zone can be controlled separately to provide localized heat supply, allowing temperature compensation for areas with higher heat loss. This enables uniform temperature distribution across the entire substrate surface despite variations in thermal characteristics across different regions.
3Productivity
If plasma etching process is performed, then etching is achieved, but fine etching control is difficult and target deterioration occurs
Solution Approach 1:
The patent segments the etching process into two distinct stages: a plasma etching stage for removing material and a heat treatment stage for controlling etching characteristics. By separating these functions and performing them sequentially in different chambers, the system achieves both high etching efficiency and precise control over etching profiles, while the heat treatment also serves to reduce target deterioration between batches.
4Manufacturing precision
If process time is extended to achieve proper etching, then etching quality is improved, but unit per equipment hour (UPEH) is reduced
Solution Approach 1:
The patent divides the manufacturing process into multiple specialized chambers that operate in sequence: plasma etching chamber, heat treatment chamber, and cooling chamber. This segmentation allows each chamber to perform its specific function efficiently at optimized parameters, reducing the total process time while maintaining high etching quality. The parallel operation of multiple chambers increases overall equipment utilization and UPEH.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances process efficiency by stabilizing substrate position, controlling gas flow, and ensuring uniform heat treatment, thereby improving UPEH and minimizing target deterioration.
Implementation Method 1
a cooling unit configured to supply refrigerant to the heat treatment chamber, and a refrigerant supplier configured to supply refrigerant to the cooling unit
Implementation Method 2
a heat source unit configured to supply heat for heat treatment of the substrate
Data Source
AI summary
Proposed are a substrate support unit and a heat treatment device including the same. More particularly, proposed is a technology that controls a gas flow flowing over the surface of a substrate by using a pin assembly capable of adjusting inclination of the substrate, controls heat treatment of the substrate by differently supplying heat to each area of the substrate, and rapidly lowers the temperature of a substrate processing space and the substrate by using a cooling unit.