Multi-Chamber Substrate Processing with Pipe Temperature Matching
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Solution Overview
Problem
In semiconductor device manufacturing, the miniaturization of patterns leads to non-uniform formation due to variations in temperature and processing time across different chambers, especially when the lengths of pipes supplying processing solutions to these chambers are mismatched, resulting in inconsistent pattern formation.
Innovation Solution
A substrate processing apparatus with temperature-adjusting pipes surrounding the shorter pipes to ensure uniform temperature control of processing solutions, matching the temperature of solutions supplied to both chambers, and using support units to rotate substrates for uniform processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the pipe lengths to different chambers are made equal, then uniform temperature distribution is achieved, but the structural layout flexibility and chamber stacking configuration are restricted
Solution Approach 1:
The patent applies local quality by providing a temperature adjusting pipe specifically around the shorter pipe (first pipe) rather than uniformly modifying all pipes. This localized temperature control allows the system to maintain different pipe lengths for structural flexibility while achieving uniform temperature distribution at the chamber level, resolving the contradiction between temperature uniformity and layout flexibility
Solution Approach 2:
The patent changes the temperature parameter of the processing solution in the shorter pipe by introducing a temperature adjusting pipe through which temperature adjusting solution flows. This parameter adjustment compensates for the temperature difference caused by unequal pipe lengths, enabling uniform processing conditions across chambers without requiring equal pipe lengths
2Manufacturing precision
If strict temperature management is implemented, then pattern uniformity is improved, but processing time and operational complexity increase
Solution Approach 1:
The patent implements preliminary action by pre-adjusting the temperature of the processing solution in the shorter pipe before it enters the chamber. The temperature adjusting pipe is configured to maintain the processing solution at the desired temperature throughout the pipe, so that when the solution reaches the chamber, the temperature is already optimized, eliminating the need for additional temperature management steps during processing
Solution Approach 2:
The patent introduces a temperature adjusting solution as an intermediary substance that flows through the temperature adjusting pipe surrounding the processing solution pipe. This intermediary enables heat exchange to maintain the processing solution temperature without requiring direct intervention or complex control mechanisms during the actual processing operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of uniformly sized patterns across chambers by maintaining consistent processing conditions, reducing deviations in pattern formation and enhancing the uniformity of semiconductor device manufacturing.
Implementation Method 1
a temperature adjusting pipe configured to surround at least a part of the first pipe, through which the temperature adjusting solution flows to adjust a temperature of the first processing solution
Implementation Method 2
a cooling flow path configured to supply a cooling fluid to cool the first and second support units
Data Source
AI summary
A method of manufacturing a semiconductor device may comprise loading a first substrate and a second substrate into a substrate processing apparatus, wherein the first substrate is loaded into a first chamber and the second substrate is loaded into a second chamber on the first chamber, and processing the loaded first substrate and the loaded second substrate, wherein the substrate processing apparatus comprises, the first and second chambers, a first pipe through which a first processing solution supplied to the first chamber to process the first substrate is moved, a second pipe through which a second processing solution supplied to the second chamber to process the second substrate is moved, and a temperature adjusting pipe configured to surround at least a part of the first pipe, through which the temperature adjusting solution adjusting a temperature of the first processing solution is moved, wherein a length of the first pipe is shorter than a length of the second pipe.