Thin Substrate Pitch Measurement via Laser Scanning and Rotation
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Solution Overview
Problem
Conventional measurement equipment for thin substrates, such as semiconductor wafers and LCD glass substrates, fails to detect displacement and excessive sag or concavity accurately, leading to potential damage during handling and transfer processes, especially with larger substrates where gravitational sag occurs.
Innovation Solution
A thin substrate pitch measurement equipment incorporating an optical component with a light-transmitter and light-receiver, a scanning device for vertical movement, and a rotation base that allows the container body to be rotated for measuring pitch from different angles, enabling quantitative assessment of substrate positions and sag detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional light-transmitter and light-receiver detection systems are used, then displacement of thin substrates can be detected, but quantitative measurement of pitch and sag cannot be performed
Solution Approach 1:
The patent replaces the conventional mechanical/discrete optical detection system with a laser-based optical measurement system. A laser transmitter projects a laser beam through the container body, and a laser receiver detects the beam position. By measuring the position of the laser beam relative to substrate edges, the system achieves quantitative measurement of pitch and sag, converting qualitative displacement detection into precise quantitative measurement.
2Adaptability or versatility
If measurement is performed from a single position, then the structure is simple, but pitch cannot be measured from different angles or positions
Solution Approach 1:
The patent implements a universal measurement system where the container body can be rotated to multiple angular positions (0°, 45°, 90°, 135°, etc.), allowing the same laser transmitter and receiver to measure pitch from multiple angles and positions. This multi-functional capability enables comprehensive substrate placement verification without requiring separate measurement systems for different orientations.
3Productivity
If larger substrates (12'' or 18'') are used, then production capacity increases, but gravitational sag occurs causing cracking or damage
Solution Approach 1:
The patent performs pitch and sag measurement before substrates are transferred or processed further. By measuring the position and flatness of substrates while they are still in the container body at various angular positions, the system identifies substrates with excessive sag or improper placement beforehand, preventing damage during subsequent handling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise detection of substrate displacement and sag, preventing damage during handling and ensuring accurate positioning, thereby reducing the risk of cracking or damage to substrates during processing.
Implementation Method 1
The light-transmitter is used to transmit a light beam through one of the thin substrates in the container body and the light-receiver is used to detect the light beam
Data Source
AI summary
The present invention provides an equipment for measuring the vertical distance or pitch between a plurality of thin substrates inside a container body, including an optical component to transmit a light beam to a thin substrate in the container body and receive light beam reflected from the thin substrate, a scanning device to drive the optical component to move along vertical direction of the thin substrates for measuring the vertical distance or pitch between the plurality of thin substrates in the container body, and a rotation base to carry and rotate the container body to a plurality of angles for the plurality of thin substrates inside the container body to be measured from different angular positions.