Substrate Supporting Plate Edge Anodization for Rear-Side Gas Sealing

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Solution Overview

Problem

During semiconductor thin film deposition, residual gases can contaminate the substrate and reactor, leading to device malfunction due to unwanted deposition on the rear surface of the substrate and diffusion of contaminants in the reactive space.

Innovation Solution

A substrate supporting plate with an anodized edge portion and a central non-anodized portion is used, featuring an insulating layer on the top surface, which prevents source and reactive gases from reaching the rear surface of the substrate, ensuring effective face sealing and easy substrate unloading.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the substrate mounting portion is entirely anodized to prevent gas penetration, then contamination prevention is improved, but substrate unloading difficulty increases due to strong adhesion

Engineering Contradiction:

ImprovecontaminationVSAvoidsubstrate unloading

Core Design Contradiction:

Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The substrate mounting portion is divided into two regions with different anodization states: an edge portion that is anodized to prevent gas penetration and contamination, and a central portion that remains non-anodized to reduce adhesion strength and facilitate substrate unloading. This segmentation allows each region to perform its specific function optimally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different surface properties are applied to different locations of the substrate mounting portion. The edge portion has high adhesion (anodized) to seal against gas penetration, while the central portion has low adhesion (non-anodized) to enable easy substrate release. This local differentiation of surface quality resolves the contradiction between contamination prevention and ease of unloading.

Inventive Principle:

Principle #3Local quality

2Ease of operation

If the substrate mounting portion is not anodized to facilitate substrate unloading, then ease of operation is improved, but gas penetration and contamination increase

Engineering Contradiction:

Improvesubstrate unloadingVSAvoidgas penetration

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The substrate mounting portion is segmented into an anodized edge portion for gas sealing and a non-anodized central portion for easy unloading. This segmentation ensures that the gas barrier function is maintained at the perimeter while the central area allows for simple substrate release.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The edge portion is anodized to provide high adhesion and gas tightness, while the central portion remains non-anodized to provide low adhesion for easy substrate removal. This local quality differentiation prevents gas penetration at the edges while facilitating unloading from the center.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If the entire substrate supporting plate is anodized to prevent contamination, then contamination prevention is improved, but manufacturing complexity increases

Engineering Contradiction:

ImprovecontaminationVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The anodization process is segmented to treat only the edge portion of the substrate mounting portion rather than the entire plate. This partial anodization reduces manufacturing complexity compared to full anodization while still providing adequate contamination prevention at the critical perimeter regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of uniformly anodizing the entire substrate supporting plate, only the edge portion receives the anodized coating. This localized treatment reduces material consumption, processing time, and manufacturing complexity while maintaining effective contamination prevention where it is most needed.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution prevents contamination and ensures high-quality thin film deposition by minimizing gas penetration to the rear surface, facilitating easy substrate unloading and reducing reactor contamination.

Implementation Method 1

an edge portion of a top surface of the substrate mounting portion is anodized

Methodology Applied

Scientific EffectAnodizing: Anodising

Implementation Method 2

The anodized edge portion may have a thickness ranging from about 10 μm to about 100 μm. An insulating layer may be formed on a top surface of the edge portion due to the anodizing. The insulating layer may include aluminum oxide.

Methodology Applied

Scientific EffectOxidation: Oxidation

Data Source

PatentUS20230392278A1Substrate supporting plate, apparatus including the substrate supporting plate, and method of using same

Publication Date: 2023.12.07 ASM IP HLDG BV

AI summary

A substrate supporting plate that provides improved processing uniformity is disclosed. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. A portion of the peripheral portion may include an insulating layer. A central portion of the top surface may not include the insulating layer.