Substrate Support Plate With PCM and Liquid Cooling for Rapid Heat Removal
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Solution Overview
Problem
Existing cooling systems for substrates in semiconductor manufacturing processes are inadequate for rapid cooling, particularly during transitions from high-temperature processes, necessitating improved cooling performance.
Innovation Solution
An apparatus with a support plate containing a first accommodation space filled with a phase change material and a second cooling means using cooling liquid, combined with heat transfer members to enhance thermal conductivity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling means using cooling liquid is used, then the substrate can be cooled, but the cooling performance is insufficient for rapid cooling requirements
Solution Approach 1:
The patent utilizes phase change material (PCM) that transitions between solid and liquid states to absorb and release latent heat. The PCM is contained in an accommodation space within the support plate, allowing it to directly contact the substrate and provide rapid cooling through phase transition, thereby resolving the contradiction between adequate cooling and fast cooling speed
Solution Approach 2:
The cooling system is divided into two distinct cooling means: a first cooling means using phase change material for rapid cooling, and a second cooling means using cooling liquid for continuous cooling. This segmentation allows each cooling mechanism to optimize its function, with the PCM providing quick initial cooling and the cooling liquid maintaining continuous temperature control
2Productivity
If a single cooling means is used, then the structure is simple, but the cooling efficiency is insufficient
Solution Approach 1:
The cooling system is segmented into two functional parts: a first cooling means with phase change material for rapid cooling and a second cooling means with cooling liquid for continuous cooling. This segmentation enables high cooling efficiency while maintaining relatively simple structural implementation
Solution Approach 2:
The patent merges two different cooling mechanisms (phase change cooling and liquid cooling) into a single integrated support plate structure. The accommodation space for PCM and the cooling liquid channels are combined within the same support plate, achieving efficient cooling through the synergistic effect of both methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves rapid and efficient cooling of substrates by leveraging latent heat energy and continuous phase changes, improving cooling performance and reducing thermal resistance.
Implementation Method 1
a first cooling means accommodated in the first accommodation space and including a phase change material
Implementation Method 2
The apparatus achieves rapid and efficient cooling of substrates by leveraging latent heat energy and continuous phase changes
Implementation Method 3
a second cooling means disposed in the support plate and disposed to have at least a portion of the first cooling means interposed between the second cooling means and an upper surface of the support plate, and including cooling liquid flowing in the support plate
Implementation Method 4
a heat transfer member disposed on an internal wall surface of the first accommodation space and in contact with the phase change material
Data Source
AI summary
An apparatus for processing a substrate includes a support plate including a first accommodation space having a disk shape disposed therein and supporting a substrate; a first cooling means accommodated in the first accommodation space and including a phase change material; and a second cooling means disposed in the support plate and disposed to have at least a portion of the first cooling means interposed between the second cooling means and an upper surface of the support plate, and including cooling liquid flowing in the support plate.