Substrate Plating Distribution Casing for Stray-Current Isolation
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Solution Overview
Problem
Large substrate panels in high-speed plating systems experience non-uniform material deposition due to stray currents caused by deformation of non-metallic HSPs, which cannot be overcome with current designs.
Innovation Solution
A distribution system comprising a first and second distribution body, surrounded by a framework, forms a casing that electrically isolates the substrate, using sealing units to prevent stray currents and allowing for adjustable size compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If non-metallic HSPs are used in large substrate plating systems, then the HSPs can be manufactured with current materials, but stray currents appear due to deformation during temperature variation
Solution Approach 1:
The system is divided into a rigid framework structure and separate distribution bodies. The framework provides stable geometric support while distribution bodies handle the electrochemical function, isolating the current path from thermal deformation effects.
Solution Approach 2:
A rigid framework acts as an intermediary between the distribution bodies and the substrate, maintaining fixed geometric relationships and preventing deformation-induced current leakage paths from forming.
2Stability of the object's composition
If HSPs deform during temperature variation, then material gaps appear and disappear, but this creates unwanted avenues for stray currents
Solution Approach 1:
The harmful effect of deformation is extracted from the current distribution system by using a rigid framework that does not deform, separating the structural support function from the distribution function.
Solution Approach 2:
The design accepts that some components may deform but uses the rigid framework to convert this into a benefit by maintaining stable current paths that are independent of thermal expansion effects.
3Ease of manufacture
If the casing is formed by distribution bodies alone, then manufacturing is simpler, but electrical sealing and isolation cannot be ensured
Solution Approach 1:
The casing is formed as a composite structure combining the rigid framework with distribution bodies, where each material contributes its superior properties: the framework provides rigidity and electrical isolation while the distribution bodies provide fluid distribution functionality.
Solution Approach 2:
The framework and distribution bodies are merged into a single integrated casing structure that simultaneously provides mechanical support, electrical isolation, and fluid distribution functions.
4Manufacturing precision
If strict manufacturing tolerances are applied to accommodate large substrates, then deposition uniformity improves, but device complexity and adjustment requirements increase
Solution Approach 1:
The rigid framework creates a stable geometric reference system that establishes equipotential relationships between distribution points, ensuring uniform current distribution across large substrates without requiring complex active adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures uniform material deposition by preventing stray currents and accommodating substrates of varying sizes without requiring strict manufacturing tolerances or adjustments.
Implementation Method 1
The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate... The casing ensures an electrical isolation of the distribution system and thereby provides an electrical sealing effect
Implementation Method 2
the first distribution body (11) is configured to direct a flow of the process fluid and/or an electrical current to the substrate... the electrolyte (and with this the current distribution) is directed through the HSP plate(s) towards the substrate surface(s)
Implementation Method 3
device for chemical and/or electrolytic surface treatment of a substrate in a process fluid... one or two HSPs together with one or two substrates are immersed into a tank containing an electrolyte... resulting in unwanted, non-uniform material deposition on the substrate
Data Source
AI summary
The present disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the distribution system, and a method for manufacturing the distribution system. The distribution system comprises: a first distribution body, a substitute body, and a framework. The first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution body and the substitute body are arranged to insert the substrate between them. The framework is configured to mount the first distribution body and the substitute body relative to each other. The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate.