Substrate Plating Holder Protrusions for Uniform Film Thickness
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in maintaining in-surface uniformity of temperature during plating processing due to thermal influences from the holder and rotation shaft, leading to non-uniform plating film thickness.
Innovation Solution
The substrate processing apparatus employs a holder with protrusions having a height of at least 1 mm and a heating device with individually controlled heating elements in the cover body to minimize heat conduction from the substrate and achieve uniform temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional holder without protrusions is used, then the holder structure is simple, but thermal influence from the holder causes non-uniform temperature distribution on the substrate
Solution Approach 1:
The holder surface is segmented into multiple protrusions distributed across the holder face. Each protrusion acts as an independent thermal barrier element, creating discrete thermal isolation zones that prevent heat conduction to specific areas of the substrate, thereby achieving uniform temperature distribution without requiring a completely complex holder structure
Solution Approach 2:
The protrusions serve as intermediary thermal barrier elements between the holder and the substrate. These protrusions mediate the thermal interaction by creating air gaps and physical separation that reduce heat conduction, acting as a simple yet effective thermal management intermediary structure
2Manufacturing precision
If the holder直接接触 the substrate, then the holder provides stable support, but heat conduction from the holder causes temperature non-uniformity
Solution Approach 1:
The harmful thermal conduction path is extracted and eliminated by introducing protrusions that separate the holder from the substrate contact area. The protrusions remove the direct thermal coupling while maintaining mechanical support, extracting the harmful heat conduction function from the holder-substrate interface
Solution Approach 2:
The protrusions act as intermediary elements that break the direct thermal path between the holder and substrate. These intermediary structures provide mechanical support while preventing harmful heat conduction, serving as a mediator that maintains structural function while eliminating thermal loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances in-surface temperature uniformity, resulting in improved uniformity of plating film thickness across the substrate.
Implementation Method 1
The holder is configured to attract and hold a substrate
Implementation Method 2
configured to heat the plating liquid on the substrate by using a heating device provided in a ceiling member
Implementation Method 3
heat the plating liquid on the substrate by using a heating device
Data Source
AI summary
A substrate processing apparatus 5 includes a holder 52 (52A), a supply 53 and a cover body 6. The holder 52 (52A) is configured to attract and hold a substrate W. The supply 53 is configured to supply a heated plating liquid to the substrate W attracted to and held by the holder 52 (52A). The cover body 6 is configured to cover the substrate W attracted to and held by the holder 52 (52A), and heat the plating liquid on the substrate W by using a heating device 63 provided in a ceiling member 61 thereof facing a top surface of the substrate W. The holder 52 (52A) includes protrusions 130 projecting from a facing surface 110 thereof facing a bottom surface of the substrate W toward the bottom surface of the substrate W, and each protrusion has a protruding height equal to or larger than 1 mm.