Substrate Plating Temperature Control via Cover Heating and Bottom Cooling
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Solution Overview
Problem
Existing substrate processing techniques face challenges in maintaining a constant temperature of the plating liquid during electroless plating, leading to temperature fluctuations and potential inconsistencies in the plating film formation.
Innovation Solution
A substrate processing method that involves holding a substrate, supplying a plating liquid, covering the substrate with a cover body equipped with a heating device, and providing a cooling gas supply to the bottom surface of the substrate or holder, allowing for precise temperature control of the plating liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the plating liquid is heated by a heater provided in the cover body, then the plating liquid temperature increases, but the temperature becomes difficult to maintain constant due to overheating
Solution Approach 1:
The invention applies preliminary anti-action by introducing a cooling gas supply mechanism that counteracts the heating effect before temperature runaway occurs. The cooling gas is supplied to the holder or substrate from below during the heating process, creating a preemptive counterbalance that prevents the plating liquid temperature from rising excessively, thereby maintaining temperature constancy throughout the electroless plating process.
Solution Approach 2:
The invention uses an intermediary substance (cooling gas) to mediate between the heating source and the plating liquid. The cooling gas acts as a thermal regulator, absorbing excess heat from the holder or substrate and preventing direct thermal runaway to the plating liquid, thus enabling precise temperature control during the heating process.
2Reliability
If cooling gas is supplied to control temperature, then temperature stability improves, but the system complexity increases
Solution Approach 1:
The holder serves multiple functions: it supports the substrate during processing and simultaneously acts as a cooling structure through which cooling gas is supplied. This multi-functionality eliminates the need for separate cooling mechanisms, reducing overall system complexity while maintaining temperature control capability.
Solution Approach 2:
The system uses the existing holder structure to provide cooling functionality, allowing the holder to serve its own temperature regulation needs. The cooling gas supply mechanism utilizes the holder's inherent structure, enabling the system to self-regulate temperature without requiring additional complex external cooling apparatus.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively maintains the temperature of the plating liquid constant, preventing temperature rises and ensuring consistent plating film formation, thereby improving the uniformity and quality of the electroless plating process.
Implementation Method 1
heating the plating liquid by using a heating device provided in the cover body
Implementation Method 2
supplying cooling gas to a bottom surface of the substrate or the holder from below the substrate
Data Source
AI summary
A substrate processing method includes holding a substrate W by using a holder 52 configured to hold the substrate; supplying a plating liquid L onto a top surface of the held substrate; covering the substrate by using a cover body 6 before or after the supplying of the plating liquid; heating the plating liquid on the substrate by using a heating device 63 provided in the cover body, while keeping the substrate covered with the cover body; and supplying a cooling gas to a bottom surface of the substrate or the holder from below the substrate in the heating of the plating liquid.