Punch Type Substrate Strip With Plating-Trace Collecting Holes
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Solution Overview
Problem
Conventional punch type substrate strips face challenges in increasing the layout space of broken ends of plating traces, leading to excessively dense plating traces and restricted space for circuit layout, which affects electrical communication and adds manufacturing complexity.
Innovation Solution
Incorporating plating-trace collecting holes or notches outside the substrate units, allowing second plating traces to extend and have broken ends within these features, thereby increasing the gap between plating traces and providing more extensive space for layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the density for the circuit layout of the substrate unit is increased to minimize IC package size, then the IC package size is reduced, but the space for circuit layout is gradually reduced
Solution Approach 1:
The patent extends the circuit layout space from the two-dimensional substrate surface to three-dimensional space by forming recesses (grooves) in the substrate. These recesses provide additional vertical space for routing plating traces, allowing increased circuit density without reducing the IC package footprint. The recesses create unused space within the substrate thickness that can be utilized for trace routing.
2Quantity of substance
If plating traces are laterally extended to increase layout space, then more plating traces can be accommodated, but the gap between plating traces becomes insufficient
Solution Approach 1:
Instead of laterally extending plating traces which reduces gaps between them, the patent utilizes the vertical dimension by forming recesses in the substrate. These recesses allow plating traces to be routed in three-dimensional space, increasing the number of accommodable traces while maintaining adequate lateral gaps between them for proper spacing and signal integrity.
3Adaptability or versatility
If the inner circuit of the substrate unit is directly changed to increase layout space, then circuit layout flexibility is improved, but the electrical communication, electrical shield, and strength of combined dielectric layers are affected
Solution Approach 1:
The patent segments the substrate structure by forming localized recesses that do not compromise the overall integrity of the substrate or its dielectric layers. These recesses are strategically positioned to provide layout flexibility while maintaining the continuity and strength of the combined dielectric layers. The segmentation approach allows circuit modification without affecting electrical communication or shielding across the entire substrate.
4Ease of manufacture
If slots are formed around substrate units for punching, then substrate units can be separated, but the layout space for plating traces is restricted by the slot dimensions
Solution Approach 1:
The patent compensates for the space restricted by slots around substrate units by utilizing the vertical dimension through recess formation. These recesses provide additional three-dimensional space for plating trace routing that is not constrained by the two-dimensional slot dimensions, thereby increasing the effective layout space while maintaining ease of substrate unit separation.
Data Source
AI summary
A punch type substrate strip includes a plurality of substrate units, a plurality of slots and at least one plating-trace collecting hole. The slots are formed around the substrate units. The plating-trace collecting hole is located outside the substrate units. The substrate strip is provided with a plurality of connecting pads, a plurality of first plating traces and at least one second plating trace. The connecting pads are disposed in each substrate unit, and the first plating traces and the second plating trace are electrically connected to the connecting pads. The first plating traces have a plurality of first broken ends located in the slots. The second plating trace is extended across a region located between the slots, and has a second broken end located in the plating-trace collecting hole. Accordingly, more extensive space for plating traces can be provided.