Substrate Polishing Measurement Integration
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Solution Overview
Problem
Conventional substrate processing apparatuses lack the capability to simultaneously polish and measure the peripheral portions of semiconductor wafers effectively, leading to inefficiencies in polishing processes due to separate inspection units and complex image processing requirements, which hinder the detection of surface roughness and contamination removal.
Innovation Solution
Integration of a measurement unit within the substrate processing apparatus that includes polishing, cleaning, and drying units, allowing for real-time measurement and adjustment of polishing conditions based on the measured state of the substrate's peripheral portion, enabling precise polishing and optimizing the polishing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate inspection unit with imaging devices is used to measure the peripheral portion of the substrate, then measurement capability is provided, but device complexity and processing time increase due to complex image processing requirements
Solution Approach 1:
The patent combines the measurement function into the polishing unit by integrating a measurement device that directly measures the peripheral portion of the substrate during the polishing process. This eliminates the need for a separate inspection unit and complex image processing systems, thereby reducing device complexity while maintaining measurement capability.
Solution Approach 2:
The patent replaces the optical imaging and image processing system with a direct measurement system that provides immediate measurement data. This substitution eliminates the complexity of image capture, processing, and analysis while achieving the same measurement objective more efficiently.
2Measurement precision
If a separate inspection unit is used to inspect the peripheral portion, then measurement is possible, but productivity decreases due to sequential processing requirements
Solution Approach 1:
The measurement function is merged with the polishing process in the same unit, allowing simultaneous polishing and measurement. This eliminates the sequential transfer and inspection steps, thereby improving productivity while maintaining measurement capability.
Solution Approach 2:
The patent enables continuous measurement during the polishing process, eliminating interruptions for separate inspection. The measurement unit continuously monitors the peripheral portion throughout polishing, maintaining continuous useful action and improving overall productivity.
3Difficulty of detecting and measuring
If conventional image processing is used to detect surface roughness, then inspection is possible, but measurement accuracy is insufficient for precise polishing control
Solution Approach 1:
The patent replaces the indirect optical image processing method with a direct measurement system that provides more accurate measurement data. This substitution enables precise detection of surface characteristics and dimensions, achieving the measurement accuracy needed for precise polishing control.
Solution Approach 2:
The measurement unit provides real-time measurement feedback during the polishing process, enabling dynamic adjustment of polishing parameters. This feedback mechanism ensures high measurement accuracy is utilized for precise control, improving both measurement reliability and polishing quality.
Data Source
AI summary
A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.