Substrate Polishing Pre-Cleaning Integration
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Solution Overview
Problem
The existing substrate processing systems face inefficiencies in cleaning efficiency and yield due to the need for additional preliminary cleaning steps, which complicate the layout, increase costs, and reduce process efficiency, especially when foreign substances remain on wafers after polishing.
Innovation Solution
A substrate processing system that includes a pre-cleaning region within the polishing part where substrates are pre-cleaned before being transferred to the main cleaning part, allowing for effective removal of foreign substances without modifying existing equipment or reducing process efficiency, using methods like cleaning liquid spraying, steam, heterogeneity fluid spraying, and megasonic generators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a separate preliminary cleaning space is added to perform preliminary cleaning independently, then cleaning efficiency is improved, but device complexity and layout complexity increase
Solution Approach 1:
The patent combines the preliminary cleaning function with the existing polishing part by integrating a preliminary cleaning device into the polishing chamber. The polishing part serves dual purposes: both polishing and preliminary cleaning, eliminating the need for a separate preliminary cleaning space and reducing layout complexity while maintaining cleaning efficiency
Solution Approach 2:
The polishing part is designed to perform multiple functions: polishing, preliminary cleaning, and serving as a transfer location. The preliminary cleaning device integrated into the polishing part enables it to function as both a polishing station and a preliminary cleaning station, reducing overall system complexity
2Reliability
If a separate preliminary cleaning space is added, then foreign substance removal is improved, but process time and treatment efficiency increase due to multiple transfers
Solution Approach 1:
The polishing part performs preliminary cleaning action on substrates immediately after polishing before they are transferred to the cleaning part. This preliminary cleaning removes loose foreign substances in advance, preparing substrates for the main cleaning process and improving overall foreign substance removal effectiveness
Solution Approach 2:
By integrating preliminary cleaning functionality into the polishing part, the patent eliminates the need for separate transfer steps between polishing and preliminary cleaning. Substrates remain in the polishing part during preliminary cleaning, reducing process time and improving treatment efficiency
3Reliability
If additional preliminary cleaning equipment is added, then cleaning effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the preliminary cleaning device with the existing polishing part, utilizing already-present infrastructure such as the polishing chamber, substrate holding mechanisms, and transfer systems. This integration approach minimizes additional manufacturing costs while achieving improved cleaning effectiveness
Solution Approach 2:
The polishing part is designed to perform multiple functions including polishing and preliminary cleaning, maximizing the utilization of existing equipment and reducing the need for additional specialized equipment, thereby controlling manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cleaning efficiency and yield by maximizing the removal of foreign substances before the main cleaning process, improving the overall cleaning effect and reducing the need for additional equipment or layout changes, thereby maintaining process efficiency and reducing costs.
Implementation Method 1
cleaning liquid spraying
Implementation Method 2
steam
Implementation Method 3
heterogeneity fluid spraying
Implementation Method 4
megasonic generators
Data Source
AI summary
A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.