Substrate Processing Apparatus Position Adjustment for Warped Wafer Handling
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Solution Overview
Problem
Batch type substrate processing apparatuses face challenges in collectively removing warped substrates due to alignment issues, which can prevent the arm of the substrate transport apparatus from inserting between adjacent substrates, hindering efficient processing.
Innovation Solution
The apparatus incorporates a position adjusting unit and dual transport mechanisms: a single-wafer transport mechanism for adjusting and transporting individual substrates, and a collective transport mechanism for removing multiple substrates, allowing for precise alignment and removal even when substrates are warped.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are collectively removed from the substrate container, then processing throughput is improved, but the operation fails when substrates are warped and the transport arm cannot be inserted between adjacent substrates
Solution Approach 1:
The system performs preliminary position adjustment on individual substrates before collective removal. The position adjusting unit adjusts the position of each substrate in the rotating direction, and the first substrate transport mechanism transports substrates one by one to the position adjusting unit for adjustment before they are collectively removed by the second substrate transport mechanism.
2Productivity
If substrates are handled in batch type processing, then efficiency is improved, but alignment precision deteriorates when substrates are warped
Solution Approach 1:
The system segments the substrate handling process into two distinct phases: individual position adjustment phase and collective removal phase. The position adjusting unit adjusts each substrate's position individually in the rotating direction, ensuring alignment precision, while the second substrate transport mechanism subsequently removes multiple substrates collectively, maintaining batch processing efficiency.
3Device complexity
If the transport arm is designed for collective removal, then device complexity is reduced, but adaptability deteriorates when dealing with warped substrates
Solution Approach 1:
The position adjusting unit acts as an intermediary between the substrate container and the collective removal transport mechanism. It adjusts the position of each substrate in the rotating direction to ensure proper alignment, enabling the collective removal mechanism to successfully handle warped substrates without requiring complex adaptive features.
Data Source
AI summary
A substrate processing apparatus includes a processing section that performs a batch process to a plurality of substrates. A first substrate transport mechanism removes one of substrates contained in a substrate container placed on a stage, and transport the substrate to a position adjusting unit, in which the position of the substrate in the rotating direction of the substrate is adjusted, and transports the substrate back to the substrate container. Then a second substrate transport mechanism collectively removes from the substrate container the substrates whose positions in the rotating direction have been adjusted by the position adjusting unit.