Substrate Position Calibration via Backside Pressure Measurement
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Solution Overview
Problem
Conventional substrate processing systems face challenges in accurately calibrating substrate positioning on a substrate support, leading to process non-uniformity due to incorrect placement, which is time-consuming and operator-dependent, requiring iterative adjustments and process contour mapping.
Innovation Solution
A method and apparatus for substrate position calibration using backside pressure measurements to determine a calibrated substrate position by repeatedly placing a substrate on the support, vacuum chucking, and analyzing pressure values, eliminating the need for process analysis and contour mapping, with a calibration substrate featuring through holes for precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional process contour mapping and iterative adjustments are used for substrate positioning calibration, then substrate placement accuracy can be improved, but the calibration process becomes time-consuming and operator-dependent
Solution Approach 1:
The patent replaces the conventional mechanical/iterative calibration approach with a pressure-based measurement system. Pressure sensors detect substrate position through backside pressure variations, eliminating the need for time-consuming process runs and contour mapping. This substitution of measurement methodology directly reduces calibration time while maintaining positioning accuracy.
Solution Approach 2:
The calibration system uses the substrate support's own vacuum chucking mechanism and pressure measurement capability to perform self-calibration. By measuring backside pressure during the normal vacuum chucking process, the system determines substrate position without requiring external process runs or operator intervention, making the calibration self-service and operator-independent.
2Manufacturing precision
If iterative substrate processes and measurements are performed for calibration, then positioning accuracy improves, but the complexity of the calibration process increases
Solution Approach 1:
The patent extracts the essential calibration information (substrate position) from the complex iterative process by using pressure sensors to directly measure position during vacuum chucking. This extraction of key measurement data eliminates the need for multiple process iterations and complex contour mapping, simplifying the overall calibration process while maintaining precision.
Solution Approach 2:
The backside pressure measurement acts as an intermediary that directly links the vacuum chucking process to substrate position determination. Instead of requiring complex iterative measurements and analysis, the pressure intermediary provides immediate position feedback, reducing calibration process complexity while achieving the same positioning precision.
3Measurement precision
If process runs and contour map analysis are used for calibration, then substrate position can be determined, but the operator dependency and variability increase
Solution Approach 1:
The calibration system performs self-measurement using pressure sensors that automatically detect substrate position during vacuum chucking. This self-service capability eliminates operator dependency and variability, as the system independently determines position without requiring human interpretation of contour maps or subjective judgment, thereby improving ease of operation while maintaining measurement precision.
Solution Approach 2:
The patent replaces operator-based contour map analysis with automated pressure sensor measurement. This substitution of human judgment with objective pressure-based detection eliminates operator dependency and variability, making the measurement process more consistent and easier to operate while maintaining or improving measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for repeatable and operator-independent substrate positioning calibration, reducing variation and time consumption, and enabling precise substrate placement without performing any process or analyzing results.
Implementation Method 1
vacuum chucking the substrate to the substrate support and measuring a backside pressure
Data Source
AI summary
Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.