Substrate Position Detection Using Ring-Member Light Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for determining the position of wafers or masks in semiconductor and display devices require costly image analysis algorithm modifications whenever the size or shape of the wafer or mask changes, leading to inefficiencies.
Innovation Solution
A substrate treating apparatus and method that uses line light sources to irradiate substrates and surrounding structures, allowing for position detection through image analysis without modifying the image analysis algorithm, even if the substrate or surrounding structure is modified.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If image analysis algorithm is redesigned to accommodate changes in substrate size or shape, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent uses a reference object (ring member) with a known geometric pattern that serves as a template for position detection. Instead of redesigning algorithms for each substrate type, the system captures an image of the reference object and compares it against a pre-stored reference image, eliminating the need for complex algorithm redesign while maintaining high measurement precision
Solution Approach 2:
The system changes the detection parameter from substrate-specific features to reference object features. By detecting the position of the ring member (which has fixed geometric characteristics) rather than directly detecting substrate features, the system maintains consistent detection parameters regardless of substrate variations, thus avoiding algorithm complexity increases
2Measurement precision
If vision-based position detection is used, then measurement precision is improved, but loss of time increases due to algorithm redesign requirements
Solution Approach 1:
The reference image of the ring member is pre-captured and stored in the system before actual substrate processing. This preliminary action creates a ready-to-use reference template that can be quickly compared against new images without requiring time-consuming algorithm redesign, thus eliminating time loss while maintaining precision
3Measurement precision
If position detection sensor is used to detect outer position of substrate, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent introduces a ring member as an intermediary object between the substrate and the detection system. Instead of directly detecting substrate features (which would require complex algorithms for different substrate types), the system detects the ring member's position using simple geometric comparison, then uses this information to infer substrate position, thereby reducing system complexity while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and cost-effective position detection of substrates by analyzing images of irradiated light sources, without the need for algorithm adjustments, improving process efficiency and reducing costs.
Implementation Method 1
a first light irradiation unit configured to irradiate a first light source to the substrate; an image acquisition unit configured to acquire an image information with respect to the first light source irradiated to the substrate
Data Source
AI summary
Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for allowing a position of a substrate to be known with only an analysis of an image with respect to a light source irradiated to a surrounding of the substrate. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to seat a substrate; a first light irradiation unit configured to irradiate a first light source to the substrate; an image acquisition unit configured to acquire an image information with respect to the first light source irradiated to the substrate; and an image analysis unit configured to detect a position of the substrate by inputting the image information and analyzing the first light source irradiated to the substrate within the image information which is input.