Component Built-in Substrate Positional Precision
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional component built-in multilayer printed boards using thermoplastic resin base materials face significant challenges in maintaining positional precision of embedded components during the lamination-pressing process, as the fluidization of thermoplastic resin increases the likelihood of component shifting.
Innovation Solution
Incorporating a low fluid member with a higher melting point than the thermoplastic resin into the multilayer substrate, featuring uneven portions with recessed and projected areas, which creates regions of varying pressure during hot-pressing, ensuring that the fluidized resin flows into recessed areas and stabilizes the component's position, thereby enhancing positional precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermoplastic resin base material layers are used for lamination-pressing, then ease of manufacture and bonding are improved, but positional precision of built-in components deteriorates due to fluidization and component shifting
Solution Approach 1:
The patent introduces a low fluid member with specific localized properties (higher melting point than thermoplastic resin) positioned adjacent to the built-in component. This creates a local region with controlled fluidity characteristics that prevents component shifting while maintaining the overall ease of manufacture provided by thermoplastic resin lamination-pressing.
Solution Approach 2:
The patent combines thermoplastic resin base material layers with a low fluid member having different thermal properties (higher melting point). This composite structure allows the thermoplastic resin to provide easy lamination-pressing while the low fluid member maintains positional stability during the process.
2Manufacturing precision
If low fluid member with higher melting point is introduced to prevent component shifting, then positional precision is improved, but device complexity increases
Solution Approach 1:
Rather than changing the entire substrate structure, the patent introduces a low fluid member only in the specific region adjacent to the built-in component. This localized approach improves positional precision while minimizing the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces or eliminates component shifting, ensuring high positional precision and maintaining electrical characteristics by preventing direct contact between the low fluid member and the component's electrodes, while also providing a shield effect.
Implementation Method 1
a density of the low fluid member with a melting point higher than a fluidization temperature of the base material layer is higher in a first region overlapping the recessed portion of the component than in a second region overlapping the projected portion of the component
Implementation Method 2
when the laminated base material layers are hot-pressed, a pressure of the fluidized thermoplastic resin is higher in the first region than in the second region. Thus, a portion of the fluidized thermoplastic resin in the first region with higher pressure flows into the recessed portion of the component
Implementation Method 3
maintaining electrical characteristics by preventing direct contact between the low fluid member and the component's electrodes, while also providing a shield effect
Data Source
AI summary
A component built-in substrate incorporates a chip capacitor in a multilayer substrate including laminated base material layers made of thermoplastic resin. The chip capacitor includes an uneven portion including a recessed portion and a projected portion on one side in a laminated direction. On one side of the chip capacitor in the multilayer substrate, a density of low fluid member with a melting point higher than a fluidization temperature of the base material layers is higher in a region overlapping the recessed portion of the chip capacitor than in a region overlapping the projected portion of the chip capacitor when viewed in the lamination direction.