Component-Embedded Substrate Positioning via Laser Via Holes
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Solution Overview
Problem
The existing component-embedded substrate manufacturing methods face challenges with low accuracy in positioning components and connection holes, and the adhesive layer thickness is critical for ensuring strength and insulating properties, limiting the choice of adhesives due to flow issues during application.
Innovation Solution
A method involving the formation of metal marks and sub-marks for precise positioning, followed by X-ray determination of through-holes, and copper plating to create conductive vias, ensuring accurate component placement and maintaining adhesive thickness for robust connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If adhesive is applied to the component arrangement region to fix intra-substrate components, then component positioning is achieved, but adhesive flows into connection holes reducing adhesive layer thickness and causing filler loss
Solution Approach 1:
The invention divides the processing sequence into distinct stages: first forming connection holes through the metal layer, then applying adhesive to the component arrangement region, and finally forming components. This segmentation prevents adhesive from flowing into connection holes by ensuring holes are already formed with proper boundaries before adhesive application.
Solution Approach 2:
The connection holes are formed in advance through the metal layer before adhesive is applied. This preliminary action creates defined boundaries that prevent adhesive from flowing into the holes during the subsequent adhesive application and component mounting processes.
2Reliability
If copper plating is used to connect terminals to wiring pattern, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The invention combines the connection hole formation and copper plating processes into an integrated flow. Connection holes are formed through the metal layer, then copper is plated to fill these holes and create electrical connections between terminals and the wiring pattern, merging structural and electrical functions in a unified manufacturing sequence.
Solution Approach 2:
The connection holes serve multiple functions: they provide mechanical support for the metal layer, establish electrical connection pathways, and define positioning references for subsequent component mounting. This multi-functionality reduces the need for separate specialized structures.
3Ease of manufacture
If multiple holes are used as reference for positioning components and connection holes, then component embedding is enabled, but positioning accuracy between components and connection holes deteriorates
Solution Approach 1:
The invention extracts the positioning reference function from the connection holes themselves. A separate mark (such as an alignment mark or reference mark) is formed in the metal layer specifically for positioning purposes, while connection holes are formed based on this mark. This separation ensures that connection holes serve their electrical connection function without compromising positioning accuracy.
4Device complexity
If adhesive layer thickness is reduced due to adhesive flow into connection holes, then manufacturing simplicity is maintained, but adhesive strength and insulating properties deteriorate
Solution Approach 1:
Connection holes are formed through the metal layer before adhesive is applied to the component arrangement region. This preliminary action creates defined boundaries that prevent adhesive from flowing into the holes, ensuring that the adhesive layer maintains its designed thickness and provides adequate adhesive strength and insulating properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of component positioning and adhesive layer thickness, ensuring strong and reliable electrical connections while expanding the range of adhesive options, leading to improved manufacturing efficiency and reduced defective products.
Implementation Method 1
a main mark made of a metal columnar body is formed on a second surface opposite to a first surface contacting the support plate of the metal layer; a component mounting step of positioning the component using the main mark as a reference
Implementation Method 2
a conductive via forming step of subjecting the first via hole to a plating process, then filling metal thereinto, and thereby forming a first conductive via
Data Source
AI summary
The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.