Substrate Positioning Sensors for Wafer Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face challenges in accurately positioning substrates due to positional deviations caused by warping of substrates or holders, water drops, and dust, which can lead to incorrect plating processing, especially when handling substrates with finer patterns and varied materials, requiring higher accuracy and faster positioning.
Innovation Solution
A substrate processing apparatus equipped with a stage and sensors to detect the sides of the substrate, allowing for precise correction of the substrate's center position and rotation angle, using a transporter to adjust the substrate's position relative to the stage or vice versa, enabling accurate alignment without the need for complex notch configurations or image recognition systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a laser sensor and notch configuration are used to detect substrate position, then positioning accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the essential function of position detection by removing complex notch configurations and using only simple sensors to detect substrate edges. The notch structure is eliminated, keeping only the sensor system that detects substrate presence and position through edge detection, thereby simplifying the overall device while maintaining detection capability
Solution Approach 2:
The patent uses multiple sensors positioned at different locations to detect substrate edges and reconstruct position information. By using redundant detection points (multiple sensors detecting different edges), the system creates a comprehensive position picture without requiring complex single-point detection mechanisms
2Measurement precision
If image recognition systems are used for substrate positioning, then positioning accuracy is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent replaces expensive image recognition systems with inexpensive sensor elements that detect substrate edges through simple optical or contact methods. The solution uses basic, readily available sensor technology rather than costly imaging systems, achieving functional equivalence at lower cost
Solution Approach 2:
The patent substitutes complex optical image recognition systems with simpler sensor-based detection mechanisms. Instead of using cameras and image processing algorithms, the system employs direct sensor detection of substrate edges, replacing a complex optical-mechanical system with a simpler sensing approach
3Manufacturing precision
If complex positioning mechanisms are used to handle substrates with finer patterns, then positioning accuracy is improved, but processing time increases
Solution Approach 1:
The patent performs substrate position detection and calculation of correction amounts before the actual positioning operation. By pre-calculating the required position adjustments based on sensor readings, the system prepares positioning information in advance, enabling faster execution of the positioning action without sacrificing accuracy
Solution Approach 2:
The patent implements a feedback mechanism where sensors continuously detect substrate position, the control unit calculates correction amounts, and the positioning system adjusts accordingly. This closed-loop feedback enables rapid convergence to the correct position, achieving both high accuracy and fast positioning by iteratively correcting position errors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for accurate and efficient positioning of substrates with different dimensions and orientations, improving the precision and speed of substrate alignment, reducing manufacturing costs by eliminating the need for image recognition systems and complex notch configurations.
Implementation Method 1
first and second sensors, which are fixed relative to the stage and respectively located outside the sides, extending in the second direction, of the substrate at the position facing the stage so as to detect the sides of the substrate
Data Source
AI summary
A substrate processing apparatus includes: a stage configured to place thereon a substrate or at least a portion of a substrate holding member configured to hold the substrate, the substrate having two sides extending in a first direction and two sides extending in a second direction; a transporter configured to transport the substrate to a position facing the stage; first and second sensors, which are fixed relative to the stage and respectively located outside the sides, extending in the second direction, of the substrate at the position facing the stage so as to detect the sides of the substrate, respectively; and third and fourth sensors, which are fixed relative to the stage and respectively located outside the sides, extending in the first direction, of the substrate at the position facing the stage so as to detect the sides of the substrate, respectively.