Substrate Post Assembly for Air-Gapped RF Component Mounting
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Solution Overview
Problem
Existing methods for integrating electronically active components on substrates often result in performance degradation of high-frequency circuits due to the presence of conductive or dielectric materials in close proximity, necessitating a need for circuit structures that maintain air gaps to avoid material contact.
Innovation Solution
The development of printed structures with substrate posts made of cured adhesive that protrude from the substrate surface, allowing components to be adhered to the substrate while maintaining an air gap, and using connection posts for electrical contact without direct material contact with the substrate circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are directly assembled on the substrate circuit, then integration density is improved, but RF circuit performance deteriorates due to material contact and interference
Solution Approach 1:
The substrate post is segmented into two functional parts: the adhesive portion that bonds the component to the substrate, and the protruding portion that maintains the air gap. This segmentation allows the component to be integrated onto the substrate while preventing harmful material contact with the RF circuit, thus resolving the contradiction between integration density and RF performance
Solution Approach 2:
The substrate post acts as an intermediary structure between the component and the substrate circuit. It provides mechanical support and electrical connection while maintaining physical separation through the air gap, enabling both high integration and preserved RF circuit performance
2Adaptability or versatility
If conductive or dielectric material is coated over the RF circuit for integration, then system integration is improved, but RF circuit performance deteriorates due to material interference
Solution Approach 1:
The harmful conductive or dielectric material is extracted from the vicinity of the RF circuit by positioning the substrate post exterior to the circuit area. The adhesive material is confined to the substrate post structure rather than being coated directly over the RF circuit, eliminating material interference while maintaining system integration
Solution Approach 2:
The substrate post provides localized adhesive functionality only where needed for component mounting, while the RF circuit area maintains its original material properties without additional coatings. This local differentiation allows system integration through the substrate post while preserving RF performance by avoiding material interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the performance and density of high-frequency circuits by preventing material contact, thereby reducing interference and improving circuit functionality.
Implementation Method 1
a substrate post protruding from the substrate surface exterior to the circuit area, the substrate post comprising a substrate post material that is a cured adhesive
Data Source
AI summary
A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.