Substrate Post Transfer Printing for Higher Component Throughput
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Solution Overview
Problem
Conventional methods of transfer printing require multiple transfers between a native source wafer and a destination substrate, increasing fabrication time and reducing manufacturing throughput due to the need for repeated pickups and placements of components.
Innovation Solution
The use of patterned substrates with substrate posts for selective printing of components, where a transfer device picks up components from a source wafer and adheres them to the substrate posts on the destination substrate, allowing for multiple print steps without intervening pickup steps, thereby improving manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional transfer printing methods are used with multiple transfers between source wafer and destination substrate, then components can be populated on the destination substrate, but fabrication time increases and manufacturing throughput decreases
Solution Approach 1:
The invention applies preliminary action by pre-arranging substrate posts on the destination substrate in specific patterns before the transfer printing process. These pre-configured posts enable selective component placement and allow multiple print steps to be performed without returning to the source wafer, thereby reducing fabrication time and improving manufacturing throughput
Solution Approach 2:
The substrate posts serve as an intermediary structure between the source wafer and the final component arrangement. By using these posts as intermediate holding locations, the system enables components to be transferred once to the destination substrate and then redistributed across multiple locations through subsequent printing operations, eliminating the need for repeated pickups from the source wafer
2Quantity of substance
If multiple transfers are performed to populate large destination substrates, then more components can be placed, but the number of pickup and placement operations increases
Solution Approach 1:
The invention applies segmentation by dividing the destination substrate into multiple regions, each with its own pattern of substrate posts. This allows components to be selectively placed in different regions through separate printing operations without requiring repeated transfers from the source wafer, thereby increasing the number of components placed while reducing the complexity of transfer operations
Solution Approach 2:
The invention introduces a new dimension to the transfer printing process by using vertically extending substrate posts as intermediate holding structures. This vertical dimension allows components to be held off the substrate surface, enabling multiple printing operations to access the same component pool without interference, thus increasing component placement capacity while simplifying the transfer process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing throughput by allowing multiple component print steps on a substrate without the need for repeated pickups from the source wafer, reducing fabrication time and increasing the efficiency of component placement on the destination substrate.
Implementation Method 1
picking up the components from the component source wafer by adhering the components to the stamp
Implementation Method 2
printing one or more of the picked-up components to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts
Data Source
AI summary
A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.