Substrate Posture Switching for Batch Drying Without Pattern Leaning
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Solution Overview
Problem
Existing substrate treating methods face challenges in achieving high mass productivity, uniform treatment quality, minimizing pattern leaning and water mark generation, and efficiently handling substrates with high aspect ratios, particularly in batch and single-type treatments.
Innovation Solution
A substrate treating apparatus and method that combines single-type and batch-type processes, utilizing posture changing units to transition substrates between vertical and horizontal orientations, along with dedicated treating units for organic solvents and supercritical drying, to enhance efficiency and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch-type treating method is used to improve mass productivity, then productivity increases, but pattern leaning phenomenon occurs and water marks are generated
Solution Approach 1:
The batch-type treating bath is segmented into multiple independent treating regions (first treating region, second treating region, third treating region) with different liquid levels. Each region can treat substrates independently, allowing simultaneous batch processing while controlling liquid contact to prevent pattern leaning and water marks.
Solution Approach 2:
Different regions of the treating bath are assigned different liquid levels tailored to specific substrate types. High aspect ratio substrates are placed in regions with lower liquid levels to prevent pattern leaning, while other substrates receive adequate liquid coverage for effective treatment, achieving localized optimization of treatment quality.
2Manufacturing precision
If substrates are immersed vertically in batch-type treatment, then uniform treatment quality is achieved, but pattern leaning occurs for high aspect ratio patterns
Solution Approach 1:
The treating bath provides different liquid levels in different regions to accommodate different substrate requirements. High aspect ratio substrates are positioned in regions with controlled liquid levels that prevent pattern leaning while maintaining treatment uniformity across all substrates in the batch.
Solution Approach 2:
The batch treating process is segmented into multiple independent treating regions, allowing high aspect ratio substrates to be treated in regions with optimized liquid levels that prevent pattern leaning, while other substrates receive standard treatment, thus maintaining overall batch uniformity without compromising individual substrate quality.
3Manufacturing precision
If single-type treating method is used to avoid pattern leaning, then pattern quality is maintained, but mass productivity decreases
Solution Approach 1:
The invention merges the advantages of both single-type and batch-type treating methods into a unified system. The treating bath can process multiple substrates in batch while maintaining the controlled liquid level conditions of single-type treatment, thereby achieving both high productivity and high pattern quality simultaneously.
Solution Approach 2:
The treating bath is designed to universally accommodate different substrate types and treatment requirements. It can process high aspect ratio substrates, low aspect ratio substrates, and mixed batches simultaneously by providing multiple treating regions with different liquid levels, making the system multi-functional and highly productive.
4Manufacturing precision
If drying treatment is delayed in batch-type treatment, then uniform treatment is maintained, but water marks are generated
Solution Approach 1:
The treating bath is segmented into multiple regions with different liquid levels. High aspect ratio substrates are placed in regions with lower liquid levels, which naturally reduce the amount of liquid on the substrate surface, thereby minimizing water mark formation while maintaining treatment uniformity across all substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves mass productivity, ensures uniform treatment quality, minimizes pattern leaning and water marks, and effectively handles substrates with high aspect ratios, while reducing apparatus size for increased space utilization.
Implementation Method 1
a supercritical drying unit configured to single-type treat the substrate by supplying a drying liquid to the substrate in a supercritical state
Implementation Method 2
an organic solvent treating unit configured to single-type treat the substrate by supplying an organic solvent to the substrate
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.