Substrate Transfer Layout With Independent Posture Turning
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Solution Overview
Problem
Current substrate treating apparatuses with batch-type and single-wafer modules are complex, requiring expensive six-axis robots for substrate handling, which are difficult to control and costly.
Innovation Solution
A substrate treating apparatus with a simplified construction that includes a stocker block, transferring block, and treating block, featuring a posture turning mechanism, batch process tanks, and a substrate pick-up unit with gripper and rod rotating mechanisms to handle substrates efficiently between the modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a six-axis robot or high-flexibility robot is used to perform complicated substrate handling operations, then the substrate transport reliability is improved, but the device complexity and manufacturing cost increase significantly
Solution Approach 1:
The substrate handling system is divided into multiple specialized mechanisms: a taking handling mechanism for collecting substrates, a posture turning mechanism for orientation changes, and a returning handling mechanism for transport. Each mechanism performs a specific function rather than relying on a single complex six-axis robot, thereby reducing overall system complexity while maintaining reliability
Solution Approach 2:
The transferring block is designed to perform multiple functions: it holds substrates in vertical posture, turns substrate orientation from horizontal to vertical and vice versa, and transports substrates between different treatment regions. This multi-functional design replaces the need for multiple specialized robots, simplifying the system while maintaining capability
2Reliability
If a six-axis robot or high-flexibility robot is used to perform complicated substrate handling operations, then the substrate transport reliability is improved, but the manufacturing cost increases significantly
Solution Approach 1:
Instead of using one expensive six-axis robot, the system segments substrate handling into multiple simpler, specialized mechanisms (taking handling, posture turning, returning handling). Each mechanism can be manufactured independently with lower cost, while collectively achieving the same reliable substrate transport function
Solution Approach 2:
The invention replaces expensive, complex robotic systems with simpler, more affordable mechanical mechanisms. These simpler mechanisms achieve the required functionality at a fraction of the cost of a six-axis robot, making the overall system more economically viable
3Reliability
If a six-axis robot or high-flexibility robot is used to perform complicated substrate handling operations, then the substrate transport reliability is improved, but the control difficulty increases
Solution Approach 1:
The control system is segmented into multiple independent control units, each managing a specific mechanism (taking handling, posture turning, returning handling). This modular control approach is simpler than controlling a single six-axis robot, as each unit handles a discrete function with fewer degrees of freedom, reducing overall control complexity
Solution Approach 2:
The system uses dynamic posture turning mechanisms that can adapt substrate orientation as needed, rather than relying on a statically complex robotic arm. The transferring block dynamically adjusts substrate position and orientation through coordinated action of simpler mechanisms, making control more intuitive and manageable
Data Source
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AI summary
Provided is a substrate treating apparatus can be provided that transports substrates reliably and has suppressed manufacturing cost by revising a construction of an apparatus including a batch-type module and a single-wafer-type module. The present invention especially focuses on a process by a substrate treating apparatus for picking up one substrate from substrates aligned in a vertical posture, turning a posture of the substrate to horizontal, and transporting the substrate to a predetermined position in the vicinity of a single-wafer transport region. With the present invention, a process of picking up the substrate and a process of turning the posture of the substrate are performed independently, achieving simplification in construction of a substrate pick-up unit and reduction in positional error generated when the substrate pick-up unit operates.