Substrate Potential Wirings for Compact Electromagnetic Shielding
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Solution Overview
Problem
There is a desire for further downsizing of electronic devices that incorporate electromagnetic wave shielding functionality, as conventional methods using metallic shield cases are limited in miniaturization due to physical machining constraints and increased costs.
Innovation Solution
The use of a stack structure with multiple potential and signal wirings arranged at a narrow pitch between two substrate portions, where the potential wirings function as a shield, enabling a more compact electromagnetic shield without the need for a metallic shield case, allowing for arbitrary design and reduced substrate size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a metallic shield case is used for electromagnetic wave shielding, then shielding effectiveness is achieved, but device size cannot be reduced due to physical machining constraints
Solution Approach 1:
The patent replaces the conventional metallic shield case (mechanical structure) with a wiring-based electromagnetic shield formed by potential wirings and signal wirings on substrate portions. This substitution eliminates the need for physical machining of shield cases while achieving the same electromagnetic shielding function through electrical conductive paths arranged in specific patterns between the substrate portions.
Solution Approach 2:
The patent transitions from a three-dimensional metallic shield case to a two-dimensional wiring pattern arrangement on the substrate surfaces. By arranging potential wirings and signal wirings in planar patterns between the first and second substrate portions, the shield function is achieved within the existing device footprint without requiring additional external shielding structures.
2Ease of manufacture
If a metallic shield case is used, then electromagnetic shielding is provided, but manufacturing cost increases
Solution Approach 1:
The patent replaces the expensive metallic shield case manufacturing process with a cost-effective wiring formation process. The potential wirings and signal wirings are formed directly on the substrate portions using standard PCB fabrication techniques, eliminating the need for separate metallic shield case manufacturing, assembly, and fastening operations, thereby significantly reducing manufacturing costs.
Solution Approach 2:
The patent merges the electromagnetic shielding function with the existing substrate wiring structure. The potential wirings and signal wirings that are already necessary for electrical connections between substrate portions also serve as the electromagnetic shield, eliminating the need for a separate shield case and reducing overall component count and assembly complexity.
3Adaptability or versatility
If conventional shield cases are used, then electromagnetic shielding is achieved, but design flexibility is limited
Solution Approach 1:
The patent creates a dynamic and adaptable shielding structure where the wiring patterns can be customized according to specific electromagnetic interference scenarios. The arrangement of potential wirings and signal wirings can be optimized for different frequency ranges and interference types, providing design flexibility that rigid metallic shield cases cannot achieve.
Solution Approach 2:
The patent applies local quality by arranging potential wirings and signal wirings in specific patterns at specific locations between the substrate portions. The wiring density, spacing, and configuration can be locally optimized in different regions to address specific electromagnetic interference problems in different areas of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a multi-applicable electromagnetic shield that achieves significant downsizing of electronic devices while maintaining effective electromagnetic wave shielding, reducing costs and avoiding the limitations of conventional shield cases.
Implementation Method 1
the plurality of potential wirings function as a shield that shields electromagnetic waves
Data Source
AI summary
To provide an electronic device and a connecting component which have a shield function and which enable downsizing. The electronic device includes: a substrate having a first substrate portion and a second substrate portion that is arranged at a position facing the first substrate portion; a plurality of potential wirings which are connected to the first substrate portion and to the second substrate portion and which have an arbitrary potential; and a plurality of signal wirings which are connected to the first substrate portion and to the second substrate portion and to which a signal is supplied. The first substrate portion has a mounting region of an electronic component on a side of a surface facing the second substrate portion. The plurality of potential wirings are arranged outside of the mounting region.