Substrate Heat Treatment with Pre-Dehumidification and Cooling
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Solution Overview
Problem
The existing heat treatment processes for semiconductor substrates with metal-containing resist require extended dehumidification times, leading to increased processing time and potential defects due to insufficient moisture removal and incomplete cooling.
Innovation Solution
A substrate treatment apparatus and method that includes a gas injection unit with a showerhead for controlled injection of dehumidifying and humidifying gases, improving heat treatment efficiency by regulating humidity before and after the heat treatment process, and ensuring complete moisture removal and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dehumidifying gas is supplied for a longer period to remove moisture, then moisture removal is improved, but the time required for heat treatment process increases
Solution Approach 1:
The gas injection unit performs preliminary dehumidification of the substrate before it enters the heating unit. By pre-removing moisture from the substrate surface in the outer position, the substrate is prepared in advance with reduced moisture content, so that when it undergoes heat treatment, less additional dehumidification time is needed, thus resolving the contradiction between moisture removal effectiveness and process time
Solution Approach 2:
The heat treatment process is segmented into distinct stages: pre-dehumidification in the outer position using the gas injection unit, followed by heating in the heating unit, and post-cooling in the outer position. This segmentation allows moisture removal to occur in parallel with positioning operations, rather than sequentially extending the heating cycle, thereby reducing total process time while maintaining effective moisture removal
2Reliability
If substrate is left on transfer plate for a long time to cool sufficiently, then cooling completeness is improved, but the time required for heat treatment process increases
Solution Approach 1:
The cooling process begins in advance as the substrate is transferred to the outer position immediately after heating. The gas injection unit can optionally assist cooling by injecting cooling gas, and the substrate is positioned in the outer position before final unloading, ensuring cooling starts immediately without waiting for the heating cycle to fully complete. This preliminary cooling action reduces the total time required while ensuring sufficient cooling before the substrate leaves the system
Solution Approach 2:
The substrate remains on the transfer plate in the outer position continuously from the moment it exits the heating unit until it is cooled and ready for unloading. This continuous positioning allows uninterrupted cooling to occur, eliminating idle time or repeated transfer operations. The useful action of cooling proceeds continuously without interruption, reducing total process time while ensuring complete cooling
3Loss of time
If substrate is unloaded in high temperature state to reduce waiting time, then process time is reduced, but defects occur due to insufficient cooling
Solution Approach 1:
The system incorporates monitoring to detect when the substrate has reached the appropriate temperature for unloading. The substrate is kept in the outer position on the transfer plate, allowing its temperature to be monitored in real-time. Once the substrate temperature drops to a safe level for unloading, the system automatically triggers the unloading operation. This feedback mechanism ensures substrate quality is maintained while minimizing unnecessary waiting time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time required for heat treatment, suppresses defects in metal-containing resist, and enhances the reactivity of the resist during post-exposure processing, thereby improving overall processing efficiency and quality.
Implementation Method 1
a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed
Implementation Method 2
a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed
Implementation Method 3
the substrate is cooled while staying on the transfer plate for a period of time
Implementation Method 4
dehumidifying gas is supplied to remove moisture remaining on the substrate after the heating treatment
Data Source
AI summary
Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.