Substrate Processing Prediction Using Moving Average Multivariate Analysis
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Solution Overview
Problem
Conventional prediction methods for substrate processing apparatuses are prone to errors due to measurement errors in processing result data, which can significantly reduce the accuracy of predicting plasma processing characteristics and apparatus status.
Innovation Solution
A prediction method and apparatus that utilize moving average processing and multivariate analysis to minimize the influence of errors in processing result data by collecting operation and processing result data, performing moving average processing on the data, and establishing a correlation between operation and moving average processing result data to predict future processing outcomes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional prediction methods use processing result data obtained by measuring a wafer for model creation using a measurement instrument, then the processing characteristics can be determined, but measurement errors are included in the processing result data which reduces prediction accuracy
Solution Approach 1:
The patent introduces an intermediary variable (apparatus status data such as electrode temperature, gas flow rate, and power consumption) that mediates between the operation data and processing result data. This intermediary captures the actual state of the apparatus during processing, allowing the prediction model to account for variations in measurement conditions and reduce the influence of measurement errors on prediction accuracy.
Solution Approach 2:
The patent creates a virtual copy of the measurement process by using apparatus status data to represent the processing characteristics. Instead of directly using potentially erroneous measurement results, the system creates a modeled representation of the processing outcome based on apparatus parameters, which can then be used for prediction without being affected by measurement instrument errors.
2Measurement precision
If test wafers are manufactured and processed to determine processing characteristics, then precise determination of apparatus status is achieved, but a large number of manufacturing processes and time are required
Solution Approach 1:
The patent enables the substrate processing apparatus to self-monitor and self-characterize by automatically collecting both operation data and apparatus status data during normal production processes. The system uses its own operational parameters and status information to build prediction models, eliminating the need for separate test wafer manufacturing and measurement processes, thereby improving productivity while maintaining determination accuracy.
Solution Approach 2:
The patent implements continuous data collection during normal substrate processing operations, rather than interrupting production for separate testing. The apparatus continuously monitors its own operation data and status data, allowing model creation and validation to occur continuously alongside production, thus maintaining high productivity while achieving precise processing characteristic determination.
Data Source
AI summary
A prediction method for a substrate processing apparatus is to predict processing results from operation data on the substrate processing apparatus during a procedure for processing a target processing substrate in a processing chamber of the substrate processing apparatus. The method includes the steps of: collecting operation data obtained; and obtaining a moving average of a preset number of sets of data using the processing result data collected at the data collection step. The method further includes the steps of: performing multivariate analysis using the operation data collected at the data collection step and the moving average processing result data obtained at the moving average processing step; and predicting processing results using operation data obtained when a target processing substrate, other than the target processing substrate used to obtain the correlation at the analysis step, is processed on a basis of the correlation.