Substrate Prefixing via Amorphized Surfaces for Low-Stress Bonding
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Solution Overview
Problem
The transport of aligned substrates in the semiconductor industry faces challenges such as damage risk, alignment changes, and space constraints, while existing bonding methods require high forces and temperatures, leading to inefficiencies and increased scrap rates.
Innovation Solution
A method and device where substrates are pretreated to create amorphized surfaces, allowing for spontaneous covalent bonding at room temperature in a high-vacuum environment without external pressure, with local energy input for prefixing and subsequent full-surface bonding under controlled conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are bonded using conventional methods with high forces and temperatures, then bonding strength is achieved, but substrate damage risk increases and cycle times increase
Solution Approach 1:
The patent changes the bonding parameters from high temperature and high pressure to room temperature and low pressure by modifying the substrate surfaces through plasma treatment and ion implantation. This creates reactive surfaces that bond spontaneously without requiring harsh bonding conditions, thus achieving strong bonds without substrate damage
Solution Approach 2:
The patent applies preliminary surface treatment (plasma treatment and ion implantation) to the substrates before bonding. This pretreatment modifies the substrate surfaces to be highly reactive, enabling spontaneous bonding at room temperature without requiring high forces or temperatures during the actual bonding process
2Manufacturing precision
If substrates are transported in aligned position, then alignment is maintained, but transport space requirements increase and damage risk persists
Solution Approach 1:
The patent performs preliminary alignment of substrates in a vertical position before bonding. Once aligned, the substrates are bonded in this position using the spontaneous bonding mechanism, which allows compact transport space while maintaining alignment precision through the initial positioning
3Area of stationary object
If full-surface contact bonding is performed under normal pressure, then bonding area is maximized, but bonding time increases and substrate damage risk increases
Solution Approach 1:
The patent changes the bonding mechanism from pressure-dependent to chemistry-dependent by creating reactive surfaces through plasma treatment and ion implantation. This allows full-surface contact bonding to occur spontaneously at room temperature without requiring prolonged pressure application, thus reducing cycle time while maintaining full bonding area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding quality, reduces scrap, improves flexibility, and decreases cycle times by enabling precise alignment and strong, stable substrate bonding without the need for high forces or temperatures, facilitating efficient transport and processing.
Implementation Method 1
polished and/or pretreated substrate surfaces bond spontaneously and covalently by making pure contact without additional pressure
Implementation Method 2
In a preferred high-vacuum environment (in particular −7 mbar, preferably −8 mbar)
Implementation Method 3
local energy input for prefixing
Data Source
AI summary
A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.