Substrate Preheating Chamber Isolation for Clean Temperature Control
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Solution Overview
Problem
Existing preheating apparatuses for semiconductor substrates before ion implantation processes face challenges in effectively controlling temperature and preventing contamination from lamp heaters, leading to potential substrate damage and reduced process efficiency.
Innovation Solution
The apparatus includes a preheating chamber with a cooling plate, a heater, an isolation plate, and separate gas supply and discharge systems for creating isolated spaces to control temperature and prevent contamination, using a combination of vent gases and vacuum to maintain pressure equilibrium and isolate the substrate from contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a lamp heater is used to preheat the substrate, then the heating efficiency is improved, but contamination of the substrate from the lamp heater is increased
Solution Approach 1:
The preheating chamber is divided into multiple isolated spaces by isolation plates, separating the lamp heater region from the substrate region. This segmentation allows the lamp heater to operate efficiently while preventing its contaminants from reaching the substrate, as each space can be independently evacuated and sealed.
Solution Approach 2:
Isolation plates serve as intermediary barriers between the lamp heater and the substrate. These plates physically separate the two components, allowing thermal energy to be transferred to the substrate through the isolation plate while blocking direct contact between lamp heater contaminants and the substrate surface.
2Object-affected harmful factors
If the preheating chamber is sealed to prevent contamination, then substrate cleanliness is improved, but temperature control precision is worsened
Solution Approach 1:
The sealed preheating chamber is segmented into multiple independent spaces by isolation plates. Each space can be independently evacuated and sealed, allowing precise temperature control in the substrate region while maintaining cleanliness. The segmentation enables localized environmental control without compromising overall sealing integrity.
Solution Approach 2:
The isolation plates are designed to be movable during the process cycle, allowing the chamber to transition between open and sealed states. During preheating, the isolation plates seal the spaces for precise temperature control and cleanliness maintenance. During loading/unloading, the isolation plates can move to allow substrate access while maintaining the sealed environment for the lamp heater region.
3Object-affected harmful factors
If separate gas supply and discharge systems are used for each space, then contamination control is improved, but device complexity is increased
Solution Approach 1:
The gas supply and discharge systems are segmented into separate lines for each isolated space. Each space has its own gas inlet and exhaust outlet, allowing independent contamination control. While this increases the number of components, the modular segmented structure makes the system manageable and allows independent optimization of each space's gas flow control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures precise temperature control and prevents contamination of the semiconductor substrate, enhancing the efficiency and reliability of the ion implantation process by maintaining a clean environment around the substrate.
Implementation Method 1
The heater may be arranged between the cooling plate and the substrate to heat the substrate
Implementation Method 2
the preheating apparatus may include a cooling plate for controlling a temperature of the lamp heater
Implementation Method 3
The gas discharge may be configured to individually supply vacuum to the first space and the second space
Data Source
AI summary
An apparatus for preheating a substrate includes a preheating chamber, a cooling plate, a heater, an isolation plate, a gas supplier and a gas discharger. The preheating chamber may be configured to receive the substrate. The cooling plate may be arranged on an upper surface of the preheating chamber. The heater may be arranged between the cooling plate and the substrate to heat the substrate. The isolation plate may be arranged between the cooling plate and the substrate to form a first space between the preheating chamber and the isolation plate and a second space between the cooling plate and the isolation plate. The gas supplier may be configured to individually supply a vent gas to the first space and the second space. The gas discharge may be configured to individually supply vacuum to the first space and the second space.